参数资料
型号: SM802104UMG
厂商: MICREL INC
元件分类: 时钟产生/分配
英文描述: 212.5 MHz, OTHER CLOCK GENERATOR, QCC24
封装: 4 X 4 MM, GREEN, QFN-24
文件页数: 6/11页
文件大小: 316K
代理商: SM802104UMG
Micrel, Inc.
SM802104
April 2011
4
M9999-042111-A
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VDD, VDDOx) ........................................+4.6V
Input Voltage (VIN)............................... -0.50V to VDD + 0.5V
Lead Temperature (soldering, 20s)............................ 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (Ts) ..........................-65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VDD, VDDOx)................. +2.375V to +3.465V
Ambient Temperature (TA)........................... -40°C to +85°C
Junction Thermal Resistance
(3)
QFN (
θJA)
Still-Air......................................................... 50°C/W
QFN (
ψJB)
Junction-to-Board ....................................... 30°C/W
DC Electrical Characteristics
(4)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = -40°C to +85°C.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VDD, VDDOx
2.5V Operating Voltage
2.375
2.5
2.625
V
VDD, VDDOx
3.3V Operating Voltage
3.135
3.3
3.465
V
106.25MHz - 1 output
82
105
106.25MHz - 2 outputs
98
127
212.5MHz - 1 output
92
119
IDD
REF_IN
Supply current VDD + VDDO
XTAL_SEL = 0
Outputs open
212.5MHz - 2 outputs
111
145
mA
106.25MHz - 1 output
93
120
106.25MHz - 2 outputs
109
142
212.5MHz - 1 output
103
134
IDD
XTAL
Supply current VDD + VDDO
XTAL_SEL = 1
Outputs open
212.5MHz - 2 outputs
122
159
mA
LVPECL DC Electrical Characteristics
(4)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = -40°C to +85°C. RL = 50 to VDDO - 2V
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VOH
Output High Voltage
VDDO – 1.145
VDDO – 0.97
VDDO – 0.845
V
VOL
Output Low Voltage
VDDO – 1.945
VDDO – 1.77
VDDO – 1.645
V
VSWING
Output Voltage Swing
0.6
0.8
1.0
V
Notes:
1.
Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3.
Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.
4.
The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.
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