参数资料
型号: SM802108UMG
厂商: MICREL INC
元件分类: 时钟产生/分配
英文描述: 156.25 MHz, OTHER CLOCK GENERATOR, QCC24
封装: 4 X 4 MM, GREEN, QFN-24
文件页数: 6/11页
文件大小: 457K
代理商: SM802108UMG
Micrel, Inc.
SM802108
January 2011
4
M9999-012111-A
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VDD, VDDOx) ........................................+4.6V
Input Voltage (VIN).............................. –0.50V to VDD + 0.5V
Lead Temperature (soldering, 20sec.)....................... 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (Ts) .........................–65°C to +150°C
Operating Ratings
(2)
Supply Voltage (VDD, VDDOx) ................. +2.375V to +3.465V
Ambient Temperature (TA) .......................... –40°C to +85°C
Junction Thermal Resistance
(3)
QFN (
θJA)
Still-Air.........................................................50°C/W
QFN (
ψJB)
Junction-to-Board .......................................30°C/W
DC Electrical Characteristics
(4)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = 40°C to +85°C.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VDD, VDDOx
2.5V Operating Voltage
2.375
2.5
2.625
V
VDD, VDDOx
3.3V Operating Voltage
3.135
3.3
3.465
V
IDD
Supply current VDD + VDDO
Outputs open; REF_IN source,
XTAL_SEL = 0
130
165
mA
IDD
Supply current VDD + VDDO
Outputs open; CRYSTAL source,
XTAL_SEL = 1
145
185
mA
LVPECL DC Electrical Characteristics
(4)
VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = 40°C to +85°C. RL = 50 to VDDO 2V
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VOH
Output High Voltage
VDDO – 1.145
VDDO – 0.97
VDDO – 0.845
V
VOL
Output Low Voltage
VDDO – 1.945
VDDO – 1.77
VDDO – 1.645
V
VSWING
Output Voltage Swing
0.6
0.8
1.0
V
Note:
1.
Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3.
Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4.
The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.
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