参数资料
型号: SM802121UMG TR
厂商: Micrel Inc
文件页数: 5/10页
文件大小: 0K
描述: IC FREQ SYNTH 156.25MHZ 24QFN
标准包装: 1,000
系列: ClockWorks™, RotaryWave™
类型: *
PLL:
输入: CMOS,晶体
输出: LVPECL
电路数: 1
比率 - 输入:输出: 2:1
差分 - 输入:输出: 无/是
频率 - 最大: 156.25MHz
除法器/乘法器: 是/无
电源电压: 2.375 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-VFQFN 裸露焊盘
供应商设备封装: 24-QFN(4x4)
包装: 带卷 (TR)
Micrel, Inc.
SM802121
January 2012
4
M9999-011212-A
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VDD, VDDO) .........................................+4.6V
Input Voltage (VIN)...............................0.50V to VDD + 0.5V
Lead Temperature (soldering, 20s)............................ 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (Ts) ......................... 65C to 150°C
Operating Ratings
(2)
Supply Voltage (VDD, VDDO).................. +2.375V to +3.465V
Ambient Temperature (TA).......................... 40°C to +85°C
Junction Thermal Resistance
(3)
QFN (
JA)
Still-Air......................................................... 50°C/W
QFN (
JB)
Junction-to-Board ....................................... 30°C/W
DC Electrical Characteristics
(4)
VDD = VDDO = 3.3V 5% or 2.5V 5%
VDD = 3.3V 5%, VDDO= 3.3V 5% or 2.5V 5%
TA = 40C to 85C.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VDD, VDDO
2.5V Operating Voltage
2.375
2.5
2.625
V
VDD, VDDO
3.3V Operating Voltage
3.135
3.3
3.465
V
IDD
Supply Current VDD + VDDO
XTAL_SEL = 0; REF_IN source, outputs open
78
100
mA
IDD
Supply Current VDD + VDDO
XTAL_SEL = 1; CRYSTAL source, outputs open
88
114
mA
LVPECL DC Electrical Characteristics
(4)
VDD = VDDO= 3.3V 5% or 2.5V 5%
VDD = 3.3V 5%, VDDO = 3.3V 5% or 2.5V 5%
TA = 40C to 85C. RL = 50 to VDDO 2V
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VOH
Output High Voltage
VDDO 1.145
VDDO 0.97
VDDO 0.845
V
VOL
Output Low Voltage
VDDO 1.945
VDDO 1.77
VDDO 1.645
V
VSWING
Output Voltage Swing
0.6
0.8
1.0
V
Notes:
1.
Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3.
Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4.
The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.
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