参数资料
| 型号： | SMD150F-2018-2 |
| 厂商： | TE Connectivity |
| 文件页数： | 18/20页 |
| 文件大小： | 0K |
| 描述： | POLYSWITCH PTC RESET 1.5A SMD |
| 产品培训模块： | Circuit Protection Products |
| 标准包装： | 4,000 |
| 系列： | PolySwitch® |
| 电流 - 维持(Ih)： | 1.5A |
| 电流 - 跳闸(It)： | 3A |
| 电流 - 最大： | 40A |
| 电压 - 最大： | 15V |
| R最小/最大： | 0.070 ~ 0.180 欧姆 |
| 跳闸时间： | 1s |
| 封装/外壳： | 2-SMD |
| 包装： | 带卷 (TR) |
| 其它名称： | RF0325-000 |
Solder Reflow and Rework Recommendation for Surface-mount Devices
Classification Reflow Profiles
Profile Feature
Pb-Free Assembly
Figure S14
Average ramp up rate (Ts MAX to Tp)
Preheat
? Temperature min. (Ts MIN )
? Temperature max. (Ts MAX )
? Time (ts MIN to ts MAX )
3°C/second max.
150°C
200°C
60-120 seconds
Tp
T L
Ts MAX
Ramp up
tp
t L
Critical Zone
T L to Tp
Time maintained above:
? Temperature (T L )
? Time (t L )
217°C
60-150 seconds
Ts MIN
ts
Peak/Classification temperature (Tp)
260°C
Preheat
Ramp down
Time within 5°C of actual peak temperature
Time (tp)
Ramp down rate
Time 25°C to peak temperature
30 seconds max.
3°C/second max.
8 minutes max.
25
Reflow Profile
t 25?C to Peak
Time
Note: All temperatures refer to topside of the package, measured on the package
body surface.
Solder Reflow
? Recommended reflow methods:
- IR
- Hot air
- Nitrogen
? Recommended maximum paste thickness: 0.25mm (0.010 inch)
? Devices can be cleaned using standard methods and aqueous solvents.
? We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed
underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
? Customer should validate that the solder paste amount and reflow recommendations meet its application.
? We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch
devices. It is possible that raised features could negatively impact solderability performance of our devices.
Rework
? femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices.
Please also avoid direct contact to the device.
? SMD series: rework should be confined to removal of the installed product and replacement with a fresh device.
Table S7 Tape and Reel Specifications for Surface-mount Devices (in Millimeters)
miniSMDC
and
midSMD
except
femtoSMDC
picoSMDC
nanoSMDC
microSMD decaSMDC050F/60 miniSMDE190 decaSMDC050F/60
SMD
SMD2
Description
W
P 0
P 1
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
EIA 481-1
12.0 ± 0.30
4.0 ± 0.10
8.0 ± 0.10
EIA 481-2
24.0 ± 0.30
4.0 ± 0.10
8.0 ± 0.10
EIA 481-2
16.0 ± 0.30
4.0 ± 0.10
8.0 ± 0.10
EIA 481-2
16.0 ± 0.30
4.0 ± 0.10
8.0 ± 0.10
EIA 481-2
16.0 ± 0.30
4.0 ± 0.10
12.0 ± 0.10
12
P 2
A 0
B 0
B 1 max.
D 0
F
E 1
E 2 min.
T max.
T 1 max.
K 0
Leader min.
Trailer min.
2.0 ± 0.05
Table S8
Table S8
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
2.0 ± 0.05
Table S8
Table S8
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
2.0 ± 0.05
1.95 ± 0.10
Table S8
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
2.0 ± 0.05
2.9 ± 0.10
3.50 ± 0.10
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
2.0 ± 0.05
Table S8
Table S8
8.2
1.5 + 0.10/ -.00
5.50 ± 0.05
1.75 ± 0.10
10.25
0.6
0.1
Table S8
390
160
2.0 ± 0.10
5.70 ± 0.10
11.90 ± 0.10
20.1
1.55 ± .05
11.50 ± 0.10
1.75 ± 0.10
22.25
0.6
0.1
0.95 ± 0.10
400
160
2.0 ± 0.10
5.11 ± 0.15
5.6 ± 0.23
12.1
1.5 + 0.10/ -.00
7.50 ± 0.10
1.75 ± 0.10
14.25
0.6
0.1
1.8 ± 0.15
400
160
2.0 ± 0.10
5.6 ± 0.23
8.1 ± 0.15
12.1
1.5 + 0.10/ -.00
7.50 ± 0.10
1.75 ± 0.10
14.25
0.6
0.1
3.2 ± 0.15
400
160
2.0 ± 0.10
6.9 ± 0.23
9.6 ± 0.15
12.1
1.5 + 0.10/ -.00
7.50 ± 0.10
1.75 ± 0.10
14.25
0.6
0.1
3.4 ± 0.15
400
160
132
RoHS Compliant, ELV Compliant
HF Halogen Free
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