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参数资料
| 型号： | SMDA05C-5.TBT |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 300 W, BIDIRECTIONAL, 6 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| 封装： | ROHS COMPLIANT, SOIC-8 |
| 文件页数： | 5/7页 |
| 文件大小： | 174K |
| 代理商： | SMDA05C-5.TBT |
5
2004 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SMDA05C-5 THRU SMDA24C-5
Circuit Diagram
Connection Diagram
Device Connection for Protection of Five Data Lines
The SMDAxxC-5 is designed to protect up to 5 data or
I/O lines. They are bidirectional devices and may be
used on lines where the signal polarities are above and
below ground.
The SMDAxxC-5 TVS arrays employ a monolithic struc-
ture. Therefore, the working voltage (V
RWM) and break-
down voltage (V
BR) specifications apply to the differen-
tial voltage between any two data line pins. For ex-
ample, the SMDA24C-5 is designed for a maximum
voltage excursion of ±12V between any two data lines.
The device is connected as follows:
Pins 1, 2, 3, 4, and 5 are connected to the lines
that are to be protected. Pin 8 is connected to
ground. The ground connections should be made
directly to the ground plane for best results. The
path length is kept as short as possible to reduce
the effects of parasitic inductance in the board
traces. Pins 6 and 7 are not connected.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
123
4
5
6
7
8
DATA IN
DATA OUT
DATA IN
DATA OUT
Applications Information
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
相关PDF资料 |
PDF描述 |
|---|---|
| SMDA15C-5.TBT | 300 W, BIDIRECTIONAL, 6 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| SMDA15C-5 | 300 W, BIDIRECTIONAL, 6 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| SMDA15C-5.T | 300 W, BIDIRECTIONAL, 6 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| SMDA05C-5.T | 300 W, BIDIRECTIONAL, 6 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| SMDA05C-7.TBT | 300 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, MS-012AA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SMDA05C-5TE | 制造商:SEMTECH 制造商全称:Semtech Corporation 功能描述:Bidirectional TVS Array for Protection of Five Lines |
| SMDA05C-5TR | 功能描述:TVS DIODE PD 300W VWM 5VCJ 200PF 制造商:smc diode solutions 系列:- 包装:剪切带（CT） 零件状态:在售 类型:齐纳 双向通道:5 电压 - 反向关态（典型值）:5V（最大） 电压 - 击穿（最小值）:6V 电压 - 箝位（最大值）@ Ipp:9.8V 电流 - 峰值脉冲（10/1000μs）:1A 功率 - 峰值脉冲:300W 电源线路保护:无 应用:通用 不同频率时的电容:200pF @ 1MHz 工作温度:-55°C ~ 125°C（TJ） 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商器件封装:8-SO 标准包装:1 |
| SMDA05C-7 | 功能描述:TVS ARRAY BIDIR 5.0 VWM SO-8 RoHS:是 类别:过电压，电流，温度装置 >> TVS - 二极管 系列:TVS Array™ 标准包装:10 系列:- 电压 - 反向隔离（标准值）:12V 电压 - 击穿:13.3V 功率（瓦特）:200W 电极标记:单向 安装类型:表面贴装 封装/外壳:DO-216AA 供应商设备封装:Powermite 包装:Digi-Reel® 其它名称:1PMT12AT1OSDKR |
| SMDA05C-7.T | 制造商:SEMTECH 制造商全称:Semtech Corporation 功能描述:Bidirectional TVS Array for Protection of Seven Lines |
| SMDA05C-7.TB | 制造商:Semtech Corporation 功能描述:ESD Suppressor TVS 制造商:Semtech Corporation 功能描述:ESD Suppressor TVS ±15KV 8-Pin SOIC T/R |
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