参数资料
型号: SMDA15CN-5.TB
元件分类: TVS二极管 - 瞬态电压抑制
英文描述: 300 W, BIDIRECTIONAL, 6 ELEMENT, SILICON, TVS DIODE, MS-012AA
封装: SOP-8
文件页数: 4/6页
文件大小: 162K
代理商: SMDA15CN-5.TB
4
2005 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SMDA05CN-5 THRU SMDA15CN-5
Protection for Four Bidirectional Lines
Protection for Five Bidirectional Lines
Device Connection Options for Protection of Four or
Five Data Lines
The SMDAxxCN-5 can be configured to protect either
four or five bidirectional data lines. The options for
connecting the devices are as follows:
1. Bidirectional protection of four I/O lines is achieved
by connecting pins 1, 2, 3, and 4 to the data lines.
Pins 5, 6, 7, and 8 are connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces. In this
configuration, the device can withstand the maxi-
mum specified transient impulse on four lines
simultaneously.
2. Bidirectional protection of five I/O lines is achieved
by connecting pins 1, 2, 3, 4, and 5 to the data
lines. Pins 6, 7, and 8 are connected to ground.
The ground connection should be made directly to
the circuit board ground plane for best results. In
this configuration, the device can withstand the
maximum rated transient impulse on any two lines
simultaneously.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
From Connector
To Protected IC
From Connector
To Protected IC
Applications Information
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
相关PDF资料
PDF描述
SMDF106 1 A, 800 V, SILICON, BRIDGE RECTIFIER DIODE
SMDF102 1 A, 100 V, SILICON, BRIDGE RECTIFIER DIODE
SMDF103 1 A, 200 V, SILICON, BRIDGE RECTIFIER DIODE
SMF3.3.TGT 40 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
SMFZ11V 11.51 V, 1 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE
相关代理商/技术参数
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