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参数资料
| 型号： | SMDJ9.0CA |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 3000 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB |
| 封装： | ROHS COMPLIANT, PLASTIC, SMC, 2 PIN |
| 文件页数： | 4/5页 |
| 文件大小： | 189K |
| 代理商： | SMDJ9.0CA |
56
Transient Voltage Suppression Diodes
Revision: January 09, 2009
2009 Littelfuse, Inc.
Specications are subject to change without notice.
Surface Mount – 3000W > SMDJ series
SMDJ Series
Please refer to http://www.Littelfuse.com/series/SMDJ.html for current information.
Physical Specications
Weight
0.007 ounce, 0.21 grams
Case
JEDEC DO214AB. Molded plastic body
over glass passivated junction
Polarity
Color band denotes positive end
(cathode) except Bidirectional.
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102D
Dimensions
Dimensions
Inches
Millimeters
Min
Max
Min
Max
A
0.114
0.126
2.900
3.200
B
0.260
0.280
6.600
7.110
C
0.220
0.245
5.590
6.220
D
0.079
0.103
2.060
2.620
E
0.030
0.060
0.760
1.520
F
-
0.008
-
0.203
G
0.305
0.320
7.750
8.130
H
0.006
0.012
0.152
0.305
I
0.129
-
3.300
-
J
0.094
-
2.400
-
K
-
0.165
4.200
L
0.094
-
2.400
-
Environmental Specications
Temperature Cycle
JESD22-A104
Pressure Cooker
JESD 22-A102
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Thermal Shock
JESD22-A106
Soldering Parameters
T
e
mperature
(T
)
Time (t)
T
s(min)
T
s(max)
T
L
T
P
t
s
Preheat
t
L
t
p
Ramp-up
Critical Zone
T
L
to T
P
Ramp-down
t 25C to Peak
25C
Reow Condition
Pre Heat
-Temperature Min (T
s(min))
150°C
-Temperature Max (T
s(max))
200°C
-Time (min to max) (t
s)
Average ramp up rate (LiquidusTemp
(T
L) to peak
3°C/second max
T
S(max) to TL - Ramp-up Rate
3°C/second max
Reow
-Temperature (T
L) (Liquidus)
217°C
-Time (min to max) (t
s)
PeakTemperature (T
P)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (t
p)
Ramp-down Rate
6°C/second max
Time 25°C to peakTemperature (T
P)
8 minutes Max.
Do not exceed
280°C
DO-214AB (SMC J-Bend)
Cathode Band
B
F
G
H
E
C
D
A
I
L
K
J
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| SMDLTFP250T3 | 功能描述:焊料 SOLDR PASTE LF (T3) 42n/58i 250g JAR LF RoHS:否 制造商:AIM 产品:Solder 类型:Wire, Rosin Core 合金:SAC305 描述/功能:Lead free Glow Core no-clean 直径:0.032 in 芯体大小:3 % |
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