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| 型号： | SML-212YTT86 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 7/9页 |
| 文件大小： | 444K |
| 描述： | LED 591NM YLW WTR CLR 0805 SMD |
| 产品目录绘图： | SML-21 Series Top SML-21 Series Bottom SML-21 Series Side |
| 标准包装： | 1 |
| 颜色： | 黄 |
| Millicandela 等级： | 63mcd |
| 正向电压： | 2.05V |
| 电流 - 测试： | 20mA |
| 波长 - 主： | 587nm |
| 波长 - 峰值： | 591nm |
| 透镜类型： | 透明 |
| 透镜样式/尺寸： | 矩形，带平顶，1.4mm x 1.25mm |
| 封装/外壳： | 0805（2012 公制） |
| 尺寸/尺寸： | 2.00mm L x 1.25mm W |
| 高度： | 0.80mm |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 产品目录页面： | 2935 (CN2011-ZH PDF) |
| 其它名称： | 511-1296-6 |
www.rohm.com
?2013 ROHM Co., Ltd. All rights reserved.
Data Sheet
SML-21 series
lAttention Points In Handlin
This product was developed as a surface mount LED especially suitable for reflow soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depends on the condition of the PCB,
So, please investigate about the adjustmentthoroughly before designing.
.SOLDERING Sn-Cu Sn-A -Cu Sn-A -Bi-Cu
LED products do not contain reinforcement
materials such as glass fillers.
herefore, thermal stress b solderin reatl
influences its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between the first and the second soldering process.
.HANDLING AFTER MOUNTING
As shown right drawing, in case outside force of around 1kg is given
to the device, stress is concentrated to the jointed part
between mold resin and substrate.
Therefore there is a possibility to breat the device or PCB.
Careful handing is needed as ROHM cannot guarantee the falling of the device by outside force after mounting.
.WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
sopropyl alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30篊, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15/1 litter of solvent tub.
4-4) COOLING
Below 100篊 within 3 minutes.
.EROSION GAS
tilization in erosion as atmos here ma de enerate the latin surface which mi ht cause deterioration of
solder strength, optical characteristics, or functions.
Please take precautions against occurrence of gas from the surrounding parts on the occasion of custody,
and also after mounted on circuit board.
Min.1 min Max. 40sec
Max.260篊, Within 10sec
140 to 180篊
230 to 260篊
(Fig-2)
(Fig-1)
1.1m
1.1m
1.25
1.25
PCB Bonding Direction
Outside
PCB
Mold
Substrat
Soldering
part
Emitting
7/8
2013.08 - Rev.C
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相关代理商/技术参数 |
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|---|---|
| SML-212YTT86S | 制造商:ROHM Semiconductor 功能描述:LED SMD 0805 HB YLW 制造商:ROHM Semiconductor 功能描述:LED, SMD, 0805, HB YLW 制造商:ROHM Semiconductor 功能描述:LED, YELLOW, 1.25MM X 1.4MM, 63MCD, 590NM; Bulb Size:1.25mm x 1.4mm; LED Color:Yellow; Luminous Intensity:63mcd; Forward Current If:20mA; Forward Voltage:2.05V; LED Mounting:SMD; Lens Shape:Rectangular; Wavelength Typ:590nm ;RoHS Compliant: Yes |
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