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| 型号： | SML-521MYWT86 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 8/10页 |
| 文件大小： | 582K |
| 描述： | LED 1.5X1.3MM YLW/GRN WHT/DF SMD |
| 产品目录绘图： | SML-521 Series SML-521 Series Bottom SML-521 Series Side |
| 标准包装： | 1 |
| 颜色： | 绿，黄 |
| Millicandela 等级： | 16mcd 绿，63mcd 黄 |
| 正向电压： | 2.2V 绿，1.9V 黄 |
| 电流 - 测试： | 20mA |
| 波长 - 主： | 572nm，587nm |
| 透镜类型： | 散射，白色 |
| 透镜样式/尺寸： | 矩形，带平顶，1.3mm x 1.1mm |
| 封装/外壳： | 0605（1613 公制） |
| 尺寸/尺寸： | 1.50mm L x 1.30mm W |
| 高度： | 0.60mm |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 产品目录页面： | 2936 (CN2011-ZH PDF) |
| 其它名称： | 511-1318-6 |
www.rohm.com
?2013 ROHM Co., Ltd. All rights reserved.
Data Sheet
SML-52 series
lAttention Points In Handlin
This product was developed as a surface mount LED especially suitable for soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depend on the condition of the PCB.
Thorough design review is recommended before the final designing
his product of structured with rear/bottom electrode to be soldered.
The formation of solder fillet is not guaranteed due to its electrode shape.
.SOLDERING Sn-Cu Sn-A -Cu Sn-A -Bi-Cu
LED products do not contain reinforcement
materials such as glass fillers.
herefore thermal stress b solderin reatl
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
.HANDLING AFTER MOUNTING
As shown right drawing, in case outside force of around
1kg is given to the device, stress is concentrated to the
jointed part between mold resin and substrate.
Therefore there is a possibility to breat the device or PCB.
Careful handing is needed as ROHM cannot guarantee the falling
of the device by outside force after mounting.
.WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
sopropyl alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30篊, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15/1 litter of solvent tub.
4-4) COOLING
Below 100篊 within 3 minutes.
.EROSION GAS
tilization in erosion gas atmosphere may degenerate the plating surface which might cause deterioration of
solder strength, optical characteristics, or functions.
Please take precautions against occurrence of gas from the surrounding parts on the occasion of custody,
and also after mounted on circuit board.
Min.1 min Max. 40sec
Max.250篊, Within 10sec
140 to 180篊
230 to 260篊
(Fig-1)
(Fig-2)
0.6mm
2.45mm
Outside Force
PCB
Mold
Substrate
Soldering part
Emitting Direction
8/9
2013.09 - Rev.D
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SML-521MYWT86M | 制造商:ROHM Semiconductor 功能描述:LED Green/Yellow 40/15deg White 0605 |
| SML-521MYWT86NR | 制造商:ROHM Semiconductor 功能描述:LED 0605 BI YLW/GRN 制造商:ROHM Semiconductor 功能描述:LED, 0605, BI YLW/GRN 制造商:ROHM Semiconductor 功能描述:LED, 0605, BI YLW/GRN; Luminous Intensity / Color:Y 63mcd / YG 16mcd; Forward Voltage / Color:Y 1.9V / YG 2.2V; Forward Current / Color:Y 20mA / YG 25mA; LED Mounting:SMD; Lens Shape:Rectangular; Wavelength / Color:Y 590nm / YG 570nm;RoHS Compliant: Yes |
| SML522BU1WT86 | 功能描述:Blue, Red 470nm Blue, 624nm Red LED Indication - Discrete 2.9V Blue, 1.9V Red 0605 (1513 Metric) 制造商:rohm semiconductor 系列:SML-52 包装:剪切带（CT） 零件状态:有效 颜色:蓝，红 透镜颜色:白 透镜透明度:散射 毫烛光等级:22mcd 蓝，21mcd 红 透镜样式/尺寸:矩形，带平顶，1.10mm x 1.30mm 电压 - 正向（Vf）（典型值）:2.9V 蓝，1.9V 红 电流 - 测试:5mA 蓝，5mA 红 视角:- 安装类型:表面贴装 波长 - 主:470nm 蓝，624nm 红 波长 - 峰值:- 特性:- 封装/外壳:0605（1513 公制） 供应商器件封装:1315（0605） 大小/尺寸:1.50mm 长 x 1.30mm 宽 高度（最大值）:0.70mm 标准包装:1 |
| SML522BUW | 制造商:ROHM 制造商全称:Rohm 功能描述:2-color type LED |
| SML522BUWT86 | 功能描述:LED 470NM/624NM BLUE/RED SMD RoHS:是 类别:光电元件 >> LED - Millicandela 等级:2260mcd 正向电压:2.1V 电流 - 测试:20mA 波长 - 主:590nm 波长 - 峰值:- 视角:- 透镜类型:散射，有色 透镜样式/尺寸:圆顶椭圆，5.1mm x 3.7mm 封装/外壳:径向 尺寸/尺寸:- 高度:7.00mm 安装类型:通孔 包装:散装 在特定电流下的光通量 - 测试:- |
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