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参数资料
| 型号： | SML0805-O3K-TR |
| 厂商： | LEDTRONICS INC |
| 元件分类： | LED |
| 英文描述： | SINGLE COLOR LED, SUPER ORANGE, 1.4 mm |
| 封装： | 2 X 1.25 MM, 1 MM HEIGHT, ROHS COMPLIANT, SMT, 2 PIN |
| 文件页数： | 5/5页 |
| 文件大小： | 893K |
| 代理商： | SML0805-O3K-TR |
Part No.
Page
5 of 5
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
DWG NO.
DSTR0191
245±5°C
5 sec.
within
Over Ux1.2
Over Ux2
Below Sx0.5
Judgment criteria for failure
2. Measurement shall be taken between 2 hours and after the test pieces have been returned to
Care must be taken not to cause damage to the epoxy resin portion of LEDs while it is exposed to high temperatures, or abrade the epoxy
resin portion of LEDs with hard or sharp items as from sand blasting and the use of sharp metallic objects.
The temperature of the iron tip should not be higher than 300°C (572°F) and soldering within 3 seconds per solder-land is to be observed.
Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution
should be taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive
care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as to be subjected to
reverse voltage when turning off the LEDs.
In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope.
If the envelope is still packed, store it in the following environment:
(1) Temperature: 5°C-30°C (41°F-86°F) Humidity: RH 60% Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH
(3) Devices require baking before mounting if: (2)a or (2)b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60°C ±3°C
Operation heating: 245°C ±5°C within 5 sec.
Preheating: 120°C~150°C, within 120~180 sec.
Gradual Cooling (Avoid quenching).
60min. 20min. 60min. 20min.
-35°C ~ +25°C ~ +85°C ~ +25°C
235°C (Max.), within 10 seconds. (Max.)
140°C - 160°C, within 2 minutes.
Connect with a power Ι = 20mA
Storage
Test time = 1,000hrs
Thermal Shock
Solder Resistance
4°C/sec.
4°C/sec. Max.
Max.
Ι (mcd)
V (V)
Ι (uA)
Symbol
JUDGEMENT CRITERIA OF FAILURE FOR THE RELIABILITY TEST
normal ambient conditions after completion of each test.
Gradual Cooling (Avoid quenching).
Operation heating: 260°C (Max.) within 10
Preheating: 140°C~160°C ±5°C, within 2 minutes.
Note: 1. U means the upper limit of specific characteristics. S means initial value.
←
Temperature
2. Handling
3. Notes for designing
4. Storage:
Time →
Manual of Soldering
1. Soldering
Environmental
Test
Cycling
Temperature
140~160°C
seconds. (Max.)
Reflow Soldering
Forward voltage
Reverse current
Measuring items
Luminous intensity
Over 2 min.
235°C
←
Temperature
Time →
Preheating:
V = 5V
Ι = 20mA
Measuring conditions
DIP Soldering (Wave Soldering)
260°C (Max.)
Test time = 5 cycles
Test time = 10 cycles
20min.
-35°C±5°C ~ +85°C±5°C
Operation heating:
JIS C 7021: A-4
MIL-STD-883: 1010
MIL-STD-750: 1051
MIL-STD-202: 107D
MIL-STD-883: 1011
MIL-STD-750: 1051
MIL-STD-202: 107D
JIS C 7021: A-1
MIL-STD-750: 2031
MIL-STD-202: 201A
Max.
10 sec.
120~180 sec.
Preheat
120°~150°C
Max. 260°C
Soldering heat
High Humidity
High Temperature
High Temperature,
Low Temperature
RELIABILITY TEST
Life
Classification
Endurance
Test
Storage
Operation
Test Item
Test time = 1,000hrs
Low T = -35°C±5°C
Test time = 1,000hrs
Test time = 240hrs
T = +65°C±5°C
High T = +85°C±5°C
T = Under room temperature
RH = 90%-95%
Reference Standard
JIS C 7021: B-10
MIL-STD-202: 1008
JIS C 7021: B-11
MIL-STD-202: 103B
JIS C 7021: B-1
MIL-STD-883: 1005
MIL-STD-750: 1026
JIS C 7021: B-12
Test Conditions
0/20
Result
0/20
r
v
f
r
f
a
f
SML0805-O3K-TR
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