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参数资料
| 型号： | SML10E3KH-TR |
| 厂商： | LEDTRONICS INC |
| 元件分类： | LED |
| 英文描述： | SINGLE COLOR LED, SUPER RED, 2 mm |
| 文件页数： | 6/6页 |
| 文件大小： | 6904K |
| 代理商： | SML10E3KH-TR |
SML10E3KH-TR
Part No.
Page
6 of 6
23105 Kashiwa Court, Torrance, CA 90505
Phone: (800) 579-4875 or (310) 534-1505 Fax: (310) 534-1424
E-mail: webmaster@ledtronics.com
Website: http://www.ledtronics.com
DWG NO.
DSTR0204
Soldering :
Manual Of Soldering
The temperature of the iron tip should not be higher than 300 (572 ) and Soldering within 3
seconds per solder-land is to be observed.
Reflow Soldering
Preheating : 140 ~160 ±5 ,within 2 minutes.
Operation heating : 235 (Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
DIP soldering (Wave Soldering) :
Preheating : 120 ~150 ,within 120~180 sec.
Operation heating : 245
5
within 5 sec.260
(Max)
Gradual Cooling (Avoid quenching).
Te
m
pe
ra
tu
re
Time
OVER 2 MIN.
4
/SEC. MAX.
4
/SEC. MAX.
10 SEC. MAX.
235
MAX.
140~160
Te
m
pera
tu
re
Time
120~180 sec.
Preheat
245°C±5 within 5 sec.
Soldering heat Max. 260
120~150
Care must be taken not to cause damage to the epoxy resin portion of LEDs while it is exposed to high temperatures, or abrade the epoxy resin
portion of LEDs with hard or sharp items as from sand blasting and the use of sharp metallic objects.
Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution should be
taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be
taken to keep the average current within the rated figures. Also, the circuit should be designed so as to be subjected to reverse voltage when
turning off the LEDs.
In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope.
If the envelope is still packed, store it in the following environment:
(1) Temperature: 5°C-30°C (41°F-86°F) Humidity: RH 60% Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH
(3) Devices require baking before mounting if: (2)a or (2)b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60°C ±3°C
2. Handling
1.
3. Notes for designing
4. Storage:
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