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参数资料
| 型号： | SMLE12BC7TT86 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 8/10页 |
| 文件大小： | 614K |
| 描述： | LED 470NM BLUE CLEAR 0603 SMD |
| 产品目录绘图： | SML-31, 51, D12, E12 Series Bottom SML-31, 51, D12, E12 Series Top SML-E12 Series Side |
| 标准包装： | 1 |
| 颜色： | 蓝 |
| Millicandela 等级： | 22mcd |
| 正向电压： | 2.9V |
| 电流 - 测试： | 5mA |
| 波长 - 主： | 470nm |
| 波长 - 峰值： | 468nm |
| 透镜类型： | 透明 |
| 透镜样式/尺寸： | 矩形，带平顶，1.2mm x 0.8mm |
| 封装/外壳： | 0603（1608 公制） |
| 尺寸/尺寸： | 1.60mm L x 0.80mm W |
| 高度： | 0.36mm |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 产品目录页面： | 2936 (CN2011-ZH PDF) |
| 其它名称： | 511-1589-6 |
www.rohm.com
?2014 ROHM Co., Ltd. All rights reserved.
Data Sheet
SML-E1 series
lAttention Points In Handlin
This product was developed as a surface mount LED especially suitable for reflow soldering.
Please take care of following points when using this device
1. DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depend on the condition of the PCB.
horough design review is recommended before the final designing.
his product of structured with rear/bottom electrode to be soldered.
The formation of solder fillet is not guaranteed due to its electrode shape
. SOLDERING ( Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu )
LED products do not contain reinforcement
materials such as glass fillers.
Therefore, thermal stress by soldering greatly
influences its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
. HANDLING AFTER MOUNTING (Fig.-3)
As shown in the drawing on the right, in case outside force of
about 700g is given to the device, stress is concentrated to the
jointed part between mold resin and substrate.
Therefore there is a possibility to breath the device or PCB.
Careful handing is needed as ROHM cannot guarantee the falling
of the device by outside force after mounting.
. WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
Isopropyl alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30篊, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15W/1 litter of solvent tub or less.
4-4) COOLING
Below 100篊 within 3 minutes.
Min.1 min Max. 40sec
Max.260篊, Within 10sec
140 to 180篊
230 to 260篊
0.8m
0.85m
0.8m
0.8m
PCB Bonding Direction
(Fig-3)
Outside
PCB
Mold
Substra
Soldering
Emitting
(Fig-2)
8/9
2014.02 - Rev.E
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SMLE12BC7TT861 | 制造商:ROHM Semiconductor 功能描述:CHIP LED, TYPE=MINI-MOLD, PACKAGE=1.6X0.8(T=0.36), COLOR = B - Tape and Reel |
| SMLE12BC7TT86-CUT TAPE | 制造商:ROHM 功能描述:SMLE12 Series 0603 Blue 22 mcd Clear 2.9 V Low Current LED Surface Mount |
| SMLE12BC7TT86Q | 制造商:ROHM Semiconductor 功能描述:LED 0603 LO-CUR. BLUE 制造商:ROHM Semiconductor 功能描述:LED, 0603, LO-CUR. BLUE 制造商:ROHM Semiconductor 功能描述:LED, BLUE, 0.8MM X 1.2MM, 22MCD, 476NM; Bulb Size:0.8mm x 1.2mm; LED Color:Blue; Luminous Intensity:22mcd; Forward Current If:20mA; Forward Voltage:2.9V; LED Mounting:SMD; Lens Shape:Rectangular; Wavelength Typ:476nm; No. of Pins:2 ;RoHS Compliant: Yes |
| SML-E12BT1P | 制造商:ROHM 制造商全称:Rohm 功能描述:EXCELEDTM series |
| SML-E12BTT86P | 制造商:ROHM 制造商全称:Rohm 功能描述:EXCELEDTM series |
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