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参数资料
| 型号： | SMLZ13BDTT86A |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 9/11页 |
| 文件大小： | 724K |
| 描述： | LED HI BRIGHT BLUE 470NM 2-PLCC |
| 标准包装： | 1 |
| 颜色： | 蓝 |
| Millicandela 等级： | 280mcd |
| 正向电压： | 3.2V |
| 电流 - 测试： | 20mA |
| 波长 - 主： | 470nm |
| 透镜类型： | 透明 |
| 透镜样式/尺寸： | 圆形，带平顶，2.4mm |
| 封装/外壳： | 2-PLCC |
| 尺寸/尺寸： | 3.50mm L x 2.80mm W |
| 高度： | 1.90mm |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 其它名称： | 846-1036-6 |
www.rohm.com
?2013 ROHM Co., Ltd. All rights reserved.
Data Sheet
SML-Z1 series
lAttention Points In Handlin
This product was developed as a surface mount LED especially suitable for reflow soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern
depends on the condition of the PCB,
So, please investigate about the adjustment
thoroughly before designing.
.SOLDERING Sn-Cu Sn-A -Cu Sn-A -Bi-Cu
LED products do not contain reinforcement
materials such as glass fillers.
herefore thermal stress b solderin reatl
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
.USE OF AUTOMATIC MOUNTING MACHINE
As for this product, the silicone resin is used as encapsulate material and the sealing part on top of LED is soft.
Therefore, please make sure not to apply the pressure upon it, as it might influence reliability.
Moreover, please use the adsorption nozzle when you use the automatic mounting machine so as not to apply
the force directly to this top sealing part.
.HANDLING AFTER MOUNTING
s shown ri ht drawin in case outside force is iven
to the device, stress is concentrated to the jointed part
between mold resin and substrate.
Careful handing is needed as ROHM cannot guarantee the falling
of the device by outside force after mounting.
Min.1 min Max. 40sec
Max.250篊, Within
140 to 180篊
230 to
(Fig-1)
PCB Bonding Direction
2.6mm
1.5mm
1.5mm
1.5mm
(Fig-2)
Soldering
PCB
Emitting Direction
Outside
9/10
2013.08 - Rev.C
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