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参数资料
| 型号： | SMP1353-050 |
| 厂商： | SKYWORKS SOLUTIONS INC |
| 元件分类： | PIN二极管 |
| 英文描述： | 100 V, SILICON, PIN DIODE |
| 封装： | CSP-4 |
| 文件页数： | 3/4页 |
| 文件大小： | 615K |
| 代理商： | SMP1353-050 |
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
Skyworks Solutions, Inc. [781] 376-3000
Fax [781] 376-3100 Email sales@skyworksinc.com www.skyworksinc.com
3
Specifications subject to change without notice. 3/03A
Land Pattern
The recommended surface mount pad pattern ensures
quality solder joint formation and high-yielding assembly,
while using minimum board space. The dimensions apply
to both Solder Mask Defined (SMD) as well as Non-Solder
Mask Defined (NSMD) pads. However, NSMD pads, in
which the solder mask is pulled back from the metal pad,
are preferred. This type of pad definition generally
produces improved solder joint reliability as well as an
increased gap under the component. The increased gap
is desirable for enhanced cleaning of flux residue and
component underfill for applications in which the
component will be encapsulated.
The solder deposit should be centered on the land pattern
as shown.
375
m
600
m
250
m
2.30 mm
2.00 mm
0.70 mm
0.45 mm
50
m
100
m
250
m
400
m
350
m
Solder Printing
The recommended land pattern, when used in
conjunction
with
the
following
solder
deposit
recommendation, provides quality solder joint formation
and high yielding assembly. Solder should be deposited
with a stencil of foil thickness from 100–125
m, and
preferably have apertures that are laser-etched and
electro-polished for optimal paste release. The chip scale
package is compatible with most lead-based and lead-free
solder pastes, though a type 3 or type 4 paste is preferred
for the fine aperture printing.
Component Placement
The CSP can easily be picked and placed on most
placement systems. Care should be taken to select a pick
nozzle that matches the component footprint. Vision
alignment after pick can be done to the package edges or
the package leads, depending on the ability of the individual
placement machine. The component should be placed as
centered as possible to the pad and print patterns to assure
even wetting and an absence of tilt or skew.
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PDF描述 |
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| SMP1340-050 | 50 V, SILICON, PIN DIODE |
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| SMP6LC05-2P-T7 | 3600 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE |
| SMP6LC6.5-2P-T7 | 3600 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SMP1353-099 | 制造商:SKYWORKS 制造商全称:SKYWORKS 功能描述:PIN Diode Chips Supplied on Film Frame |
| SMP1371-087LF | 功能描述:PIN 二极管 1.2pF max @ 20Volts .5 ohm max @ 10mA RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel |
| SMP1371-087LF-B | 制造商:Skyworks Solutions Inc 功能描述:RF PIN DIODE |
| SMP13A | 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:Surface Mount TRANSZORB Transient Voltage Suppressors |
| SMP13A-E3/84A | 功能描述:TVS 二极管 - 瞬态电压抑制器 400 Watt 13 Volt Uni RoHS:否 制造商:Vishay Semiconductors 极性:Bidirectional 工作电压: 击穿电压:58.9 V 钳位电压:77.4 V 峰值浪涌电流:38.8 A 系列: 封装 / 箱体:DO-214AB 最小工作温度:- 55 C 最大工作温度:+ 150 C |
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