参数资料
型号: SN65HVD2
厂商: Texas Instruments, Inc.
元件分类: RS-485
英文描述: EXTENDED COMMON-MODE RS-485 TRANSCEIVERS
中文描述: 扩展共模RS - 485收发
文件页数: 4/25页
文件大小: 527K
代理商: SN65HVD2
SLLS552D DECEMBER 2002 REVISED APRIL 2005
www.ti.com
4
POWER DISSIPATION RATINGS
CIRCUIT BOARD
MODEL
Low-K(1)
High-K(2)
Low-K(1)
High-K(2)
(1)In accordance with the Low-K thermal metric definitions of EIA/JESD513.
(2)In accordance with the High-K thermal metric definitions of EIA/JESD517.
(3)This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
PACKAGE
TA
25
°
C
POWER RATING
DERATING FACTOR(3)
ABOVE TA = 25
°
C
4.62 mW/
°
C
7.3 mW/
°
C
7.87 mW/
°
C
10.8 mW/
°
C
TA = 70
°
C
POWER RATING
TA = 85
°
C
POWER RATING
D
577 mW
369 mW
300 mW
913 mW
584 mW
474 mW
P
984 mW
630 mW
512 mW
1344 mW
860 mW
700 mW
THERMAL CHARACTERISTICS
PARAMETER
TEST CONDITIONS
VALUE
86.2
UNITS
θ
JB
Junction-to-board thermal resistance
D
P
56
°
C/W
θ
JC
Junction-to-case thermal resistance
D
47.1
P
54
HVD20
VCC = 5 V, TJ = 25 C,
C = 15 pF (receiver),
CL = 15 pF (receiver),
50% Duty cycle square-wave signal,
Driver and receiver enabled
25 Mbps
295
HVD21
5 Mbps
260
Typical
HVD22
RL = 54 , CL = 50 pF (driver),
500 kbps
233
HVD23
25 Mbps
302
PD
Device power dissipation
HVD24
5 Mbps
267
mW
HVD20
25 Mbps
408
HVD21
C = 50 pF, C = 15 pF (receiver),
CL = 50 pF, CL = 15 pF (receiver),
50% Duty cycle square-wave signal,
Driver and receiver enabled
5 Mbps
342
Worst case
HVD22
VCC = 5.5 V, TJ = 125 C,RL = 54 ,
500 kbps
300
HVD23
25 Mbps
417
HVD24
5 Mbps
352
TSD
Thermal shut-down junction temperature
170
°
C
RECOMMENDED OPERATING CONDITIONS
MIN
4.5
NOM
MAX
5.5
UNIT
V
Supply voltage, VCC
Voltage at any bus I/O terminal
5
A, B
20
25
V
High-level input voltage, VIH
Low-level input voltage, VIL
Differential input voltage, VID
D, DE, RE
2
VCC
0.8
V
0
A with respect to B
25
25
V
Output current
Driver
110
110
mA
Receiver
8
8
Operating free-air temperature, TA(1)
Junction temperature, TJ
(1)Maximum free-air temperature operation is allowed as long as the device recommended junction temperature is not exceeded.
40
85
°
C
°
C
40
130
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