Orderable Device
Status
(1)
Package
Type
PDIP
PDIP
Package
Drawing
N
N
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LS04N3
SN74LS04NE4
OBSOLETE
ACTIVE
14
14
TBD
Pb-Free
(RoHS)
Call TI
CU NIPDAU
Call TI
N / A for Pkg Type
25
SN74LS04NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS04NSRG4
ACTIVE
SO
NS
14
CU NIPDAU
Level-1-260C-UNLIM
SN74S04D
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74S04DE4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74S04DG4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74S04DR
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74S04DRE4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74S04DRG4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
SN74S04N
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
SN74S04N3
SN74S04NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
14
14
TBD
Pb-Free
(RoHS)
Call TI
CU NIPDAU
Call TI
N / A for Pkg Type
25
SN74S04NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
1
1
1
1
1
1
1
1
CU NIPDAU
Level-1-260C-UNLIM
SN74S04NSRE4
ACTIVE
SO
NS
14
CU NIPDAU
Level-1-260C-UNLIM
SNJ5404J
SNJ5404W
SNJ54LS04FK
SNJ54LS04J
SNJ54LS04W
SNJ54S04FK
SNJ54S04J
SNJ54S04W
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
LCCC
CDIP
CFP
LCCC
CDIP
CFP
J
W
FK
J
W
FK
J
W
14
14
20
14
14
20
14
14
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42 SNPB
A42
POST-PLATE
A42 SNPB
A42
POST-PLATE
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Addendum-Page 2