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参数资料
| 型号： | SN74AUC1G08DRLR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 门电路 |
| 英文描述： | AUC SERIES, 2-INPUT AND GATE, PDSO5 |
| 封装： | GREEN, PLASTIC, SOT-553, 5 PIN |
| 文件页数： | 12/15页 |
| 文件大小： | 737K |
| 代理商： | SN74AUC1G08DRLR |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74AUC1G08DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G08DBVRE4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G08DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G08DCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G08DCKRE4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G08DCKRG4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G08DRLR
ACTIVE
SOT
DRL
5
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G08DRLRG4
ACTIVE
SOT
DRL
5
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G08YZPR
ACTIVE
DSBGA
YZP
5
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jan-2010
Addendum-Page 1
相关PDF资料 |
PDF描述 |
|---|---|
| SN74AUC1G08YZAR | AUC SERIES, 2-INPUT AND GATE, BGA5 |
| SN74AUC1G126DRYR | AUC SERIES, 1-BIT DRIVER, TRUE OUTPUT, DSO6 |
| SN74AUC1G14DBVRE4 | AUC SERIES, 1-INPUT INVERT GATE, PDSO5 |
| SN74AUC1G17DCKRG4 | AUC SERIES, 1-INPUT NON-INVERT GATE, PDSO5 |
| SN74AUC1G17DRYR | AUC SERIES, 1-INPUT NON-INVERT GATE, DSO6 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SN74AUC1G08DRLRG4 | 功能描述:逻辑门 SNGL 2Input Pos AND Gate RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| SN74AUC1G08YEAR | 功能描述:IC SGL 2IN POS-AND GATE 5-DSBGA RoHS:是 类别:集成电路 (IC) >> 逻辑 - 栅极和逆变器 系列:74AUC 标准包装:2,000 系列:74ACT 逻辑类型:与门 电路数:4 输入数:2 特点:- 电源电压:4.5 V ~ 5.5 V 电流 - 静态（最大值）:4µA 输出电流高，低:24mA，24mA 逻辑电平 - 低:0.8V 逻辑电平 - 高:2V 额定电压和最大 CL 时的最大传播延迟:8ns @ 5V，50pF 工作温度:-40°C ~ 85°C 安装类型:表面贴装 供应商设备封装:16-TSSOP 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 包装:带卷 (TR) |
| SN74AUC1G08YEPR | 功能描述:IC SGL 2-IN POS-AND GATE 5-DSBGA RoHS:是 类别:集成电路 (IC) >> 逻辑 - 栅极和逆变器 系列:74AUC 标准包装:2,000 系列:74ACT 逻辑类型:与门 电路数:4 输入数:2 特点:- 电源电压:4.5 V ~ 5.5 V 电流 - 静态（最大值）:4µA 输出电流高，低:24mA，24mA 逻辑电平 - 低:0.8V 逻辑电平 - 高:2V 额定电压和最大 CL 时的最大传播延迟:8ns @ 5V，50pF 工作温度:-40°C ~ 85°C 安装类型:表面贴装 供应商设备封装:16-TSSOP 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 包装:带卷 (TR) |
| SN74AUC1G08YZAR | 功能描述:逻辑门 Single 2-Input Pos RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| SN74AUC1G08YZPR | 功能描述:逻辑门 SNGL 2Input Pos AND Gate RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
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