参数资料
型号: SN74CB3T3384DW
厂商: Texas Instruments
文件页数: 14/19页
文件大小: 0K
描述: IC SWITCH BUS-EXCH 10BIT 24-SOIC
标准包装: 25
系列: 74CB
类型: FET 总线开关
电路: 5 x 1:1
独立电路: 2
输出电流高,低: 32mA,64mA
电压电源: 单电源
电源电压: 2.3 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-SOIC(0.295",7.50mm 宽)
供应商设备封装: 24-SOIC
包装: 管件
SN74CB3T3384
10BIT FET BUS SWITCH
2.5V/3.3V LOW VOLTAGE BUS SWITCH WITH 5V TOLERANT LEVEL SHIFTER
SCDS159B OCTOBER 2003 REVISED MARCH 2004
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC (see Note 1)
0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control input voltage range, VIN (see Notes 1 and 2)
0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switch I/O voltage range, VI/O (see Notes 1, 2, and 3)
0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control input clamp current, IIK (VIN < 0)
50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O port clamp current, II/OK (VI/O < 0)
50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ON-state switch current, II/O (see Note 4)
±128 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND terminals
±100 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 5): DBQ package
61
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package
86
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package
46
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package
88
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltages are with respect to ground unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 6)
MIN
MAX
UNIT
VCC
Supply voltage
2.3
3.6
V
VIH
High-level control input voltage
VCC = 2.3 V to 2.7 V
1.7
5.5
V
VIH
High-level control input voltage
VCC = 2.7 V to 3.6 V
2
5.5
V
VIL
Low-level control input voltage
VCC = 2.3 V to 2.7 V
0
0.7
V
VIL
Low-level control input voltage
VCC = 2.7 V to 3.6 V
0
0.8
V
VI/O
Data input/output voltage
0
5.5
V
TA
Operating free-air temperature
40
85
°C
NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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