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参数资料
| 型号： | SN74CBT16209ADLG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 总线收发器 |
| 英文描述： | CBT/FST/QS/5C/B SERIES, DUAL 9-BIT EXCHANGER, TRUE OUTPUT, PDSO48 |
| 封装： | GREEN, PLASTIC, SSOP-48 |
| 文件页数： | 11/14页 |
| 文件大小： | 376K |
| 代理商： | SN74CBT16209ADLG4 |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9669701QXA
ACTIVE
CFP
WD
48
1
TBD
A42
N / A for Pkg Type
74CBT16209ADGGRE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBT16209ADGGRG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBT16209ADGVRE4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBT16209ADGVRG4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16209ADGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16209ADGVR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16209ADL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16209ADLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16209ADLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16209ADLRG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54CBT16209WD
ACTIVE
CFP
WD
48
1
TBD
A42
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Addendum-Page 1
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| SN74CBT16212CDGG | CBT/FST/QS/5C/B SERIES, DUAL 12-BIT EXCHANGER, TRUE OUTPUT, PDSO56 |
| SN74CBT16214CDGGR | CBT/FST/QS/5C/B SERIES, 12 1 LINE TO 3 LINE MULTIPLEXER AND DEMUX/DECODER, TRUE OUTPUT, PDSO56 |
| SN74CBT16214CDGGE4 | CBT/FST/QS/5C/B SERIES, 12 1 LINE TO 3 LINE MULTIPLEXER AND DEMUX/DECODER, TRUE OUTPUT, PDSO56 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SN74CBT16209ADLR | 功能描述:多路器开关 IC 18-Bit FET Bus Exchange Switches RoHS:否 制造商:Texas Instruments 通道数量:1 开关数量:4 开启电阻（最大值）:7 Ohms 开启时间（最大值）: 关闭时间（最大值）: 传播延迟时间:0.25 ns 工作电源电压:2.3 V to 3.6 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UQFN-16 |
| SN74CBT16209ADLRG4 | 功能描述:多路器开关 IC 3.3V ABT Octal Buff/Drv W/3-St Otpt RoHS:否 制造商:Texas Instruments 通道数量:1 开关数量:4 开启电阻（最大值）:7 Ohms 开启时间（最大值）: 关闭时间（最大值）: 传播延迟时间:0.25 ns 工作电源电压:2.3 V to 3.6 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UQFN-16 |
| SN74CBT16209DL | 制造商:Texas Instruments 功能描述: |
| SN74CBT16209DLR | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Texas Instruments 功能描述: |
| SN74CBT16210CDGGR | 功能描述:数字总线开关 IC 3.3V ABT Octal Buff/Drv W/3-St Otpt RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
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