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参数资料
| 型号： | SN74CBTD1G125DCKR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 总线收发器 |
| 英文描述： | CBT/FST/QS/5C/B SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5 |
| 封装： | GREEN, PLASTIC, SC-70, 5 PIN |
| 文件页数： | 10/13页 |
| 文件大小： | 516K |
| 代理商： | SN74CBTD1G125DCKR |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
74CBTD1G125DBVRE4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD1G125DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD1G125DBVTE4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD1G125DBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD1G125DCKRE4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD1G125DCKRG4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD1G125DCKTE4
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTD1G125DCKTG4
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTD1G125DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTD1G125DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTD1G125DCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTD1G125DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2007
Addendum-Page 1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SN74CBTD1G125DCKT | 功能描述:数字总线开关 IC Octal Edge-Trig D-Ty F-F W/3-State Otpt RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
| SN74CBTD1G384DBVR | 功能描述:数字总线开关 IC Sgle FET w/Lvl Shift RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
| SN74CBTD1G384DBVT | 功能描述:数字总线开关 IC DUAL ANALOG SWITCH RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
| SN74CBTD1G384DCKR | 功能描述:数字总线开关 IC Sgle FET w/Lvl Shift RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
| SN74CBTD1G384DCKT | 功能描述:数字总线开关 IC DUAL ANALOG SWITCH RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
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