参数资料
型号: SN74LVC1G18DCKRG4
厂商: TEXAS INSTRUMENTS INC
元件分类: 编、解码器及复用、解复用
英文描述: LVC/LCX/Z SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO6
封装: GREEN, PLASTIC, SC-70, 6 PIN
文件页数: 8/15页
文件大小: 644K
代理商: SN74LVC1G18DCKRG4
www.ti.com
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
A
Y1
3
4
S
1
Y0
6
Absolute Maximum Ratings
(1)
1-OF-2 NONINVERTING DEMULTIPLEXER
WITH 3-STATE DESELECTED OUTPUT
SCES406I – JULY 2002 – REVISED JANUARY 2007
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
INPUTS
OUTPUTS
S
A
Y0
Y1
L
Z
L
H
Z
H
L
Z
L
H
Z
H
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range(2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state(2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high or low state(2)(3)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through VCC or GND
±100
mA
DBV package
165
θ
JA
Package thermal impedance(4)
DCK package
259
°C/W
YZP package
123
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
The value of VCC is provided in the recommended operating conditions table.
(4)
The package thermal impedance is calculated in accordance with JESD 51-7.
2
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