参数资料
型号: SN74LVC1G29YEPR
厂商: Texas Instruments, Inc.
英文描述: 2-OF-3 DECODER/DEMULTIPLEXER
中文描述: 2的- 3解码器/解复用器
文件页数: 9/14页
文件大小: 305K
代理商: SN74LVC1G29YEPR
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SM8
Package
Drawing
DCT
Pins Package
Qty
3000
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LVC1G29DCTR
ACTIVE
8
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G29DCTRE4
ACTIVE
SM8
DCT
8
3000
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G29DCTT
SN74LVC1G29DCUR
PREVIEW
ACTIVE
SM8
US8
DCT
DCU
8
8
250
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
3000
3000 Green (RoHS &
no Sb/Br)
Call TI
CU NIPDAU
Call TI
Level-1-260C-UNLIM
SN74LVC1G29DCURE4
ACTIVE
US8
DCU
8
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G29DCUT
ACTIVE
US8
DCU
8
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G29DCUTE4
ACTIVE
US8
DCU
8
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G29YEPR
SN74LVC1G29YZPR
NRND
ACTIVE
WCSP
WCSP
YEP
YZP
8
8
TBD
SNPB
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 1
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