参数资料
型号: SN74LVC1G332DBVT
厂商: TEXAS INSTRUMENTS INC
元件分类: 门电路
英文描述: LVC/LCX/Z SERIES, 3-INPUT OR GATE, PDSO6
封装: PLASTIC, SOT-23, 6 PIN
文件页数: 1/17页
文件大小: 827K
代理商: SN74LVC1G332DBVT
www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOMVIEW)
2
GND
V
CC
5
3
4
B
Y
6
1
A
C
3
4
B
2
GND
Y
5
1
A
V
CC
6
C
2
GND
V
CC
1
5
A
B
4
3
Y
6
C
DESCRIPTION/ORDERING INFORMATION
The SN74LVC1G332 performs the Boolean function in Y + A ) B ) C or Y + A B C positive logic.
SINGLE 3-INPUT POSITIVE-OR GATE
SCES489D – SEPTEMBER 2003 – REVISED SEPTEMBER 2006
Available in the Texas Instruments
Latch-Up Performance Exceeds 100 mA Per
NanoStar and NanoFree Packages
JESD 78, Class II
Supports 5-V V
CC Operation
ESD Protection Exceeds JESD 22
Inputs Accept Voltages to 5.5 V
– 2000-V Human-Body Model (A114-A)
Max t
pd of 4.5 ns at 3.3 V
– 200-V Machine Model (A115-A)
Low Power Consumption, 10-
A Max I
CC
– 1000-V Charged-Device Model (C101)
±24-mA Output Drive at 3.3 V
I
off Supports Partial-Power-Down Mode
Operation
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar – WCSP (DSBGA)
SN74LVC1G332YEPR
0.23-mm Large Bump – YEP
Reel of 3000
_ _ _CZ_
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP
SN74LVC1G332YZPR
(Pb-free)
–40
°C to 85°C
Reel of 3000
SN74LVC1G332DBVR
SOT (SOT-23) – DBV
C2C_
Reel of 250
SN74LVC1G332DBVT
Reel of 3000
SN74LVC1G332DCKR
SOT (SC-70) – DCK
CZ_
Reel of 250
SN74LVC1G332DCKT
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright 2003–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
相关PDF资料
PDF描述
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相关代理商/技术参数
参数描述
SN74LVC1G332DCKR 功能描述:逻辑门 Single 3-Input Pos- OR Gate RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量(输入/输出):2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel
SN74LVC1G332DCKRG4 功能描述:逻辑门 SNGL 3 Input Pos OR Gate RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量(输入/输出):2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel
SN74LVC1G332DRLR 功能描述:逻辑门 Sngl 3 Inp Pos OR Gate RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量(输入/输出):2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel
SN74LVC1G332DRYR 功能描述:逻辑门 Sgl 3-Inp Pos-OR Gate RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量(输入/输出):2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel
SN74LVC1G332DSFR 功能描述:逻辑门 Sgl 3-Inp Pos-OR Gate RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量(输入/输出):2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel