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参数资料
| 型号： | SN74LVC2G125IDCTRQ1 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 总线收发器 |
| 英文描述： | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 |
| 封装： | PLASTIC, SSOP-8 |
| 文件页数： | 6/8页 |
| 文件大小： | 102K |
| 代理商： | SN74LVC2G125IDCTRQ1 |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CLVC2G125IDCTRQ1
ACTIVE
SM8
DCT
8
3000
TBD
Level-1-220C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SN74LVC2G125YEAR | 功能描述:缓冲器和线路驱动器 Tri-State Dual Bus RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
| SN74LVC2G125YEPR | 功能描述:IC BUS BUFF TRI-ST DL 8DSBGA RoHS:是 类别:集成电路 (IC) >> 逻辑 - 缓冲器，驱动器，接收器，收发器 系列:74LVC 标准包装:1,000 系列:74ABT 逻辑类型:寄存收发器，非反相 元件数:1 每个元件的位元数:8 输出电流高，低:32mA，64mA 电源电压:4.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC 包装:带卷 (TR) |
| SN74LVC2G125YZAR | 功能描述:特定功能逻辑 Tri-State Dual Bus RoHS:否 制造商:Texas Instruments 产品: 系列:SN74ABTH18502A 工作电源电压:5 V 封装 / 箱体:LQFP-64 封装:Tube |
| SN74LVC2G125YZPR | 功能描述:缓冲器和线路驱动器 Dual Bus Buffer Gate RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
| SN74LVC2G126DCT3 | 制造商:Texas Instruments 功能描述: |
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