参数资料
型号: SN74S74NSRG4
厂商: Texas Instruments
文件页数: 4/24页
文件大小: 0K
描述: IC FLIP FLOP D-TYPE DUAL 14SOP
标准包装: 2,000
系列: 74S
功能: 设置(预设)和复位
类型: D 型
输出类型: 差分
元件数: 2
每个元件的位元数: 1
频率 - 时钟: 110MHz
延迟时间 - 传输: 6ns
触发器类型: 正边沿
输出电流高,低: 1mA,20mA
电源电压: 4.75 V ~ 5.25 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 14-SOIC(0.209",5.30mm 宽)
包装: 带卷 (TR)
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 6
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
SNJ54LS74AW
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS74AW
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS74AW
SNJ54S74FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54S
74FK
SNJ54S74FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54S
74FK
SNJ54S74J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S74J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S74J
SNJ54S74W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S74W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S74W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
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