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参数资料
| 型号： | SNJ54LV367AFK |
| 厂商： | Texas Instruments, Inc. |
| 英文描述： | HEX BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS |
| 中文描述： | 六角缓冲器和线路驱动器，三态输出 |
| 文件页数： | 7/14页 |
| 文件大小： | 338K |
| 代理商： | SNJ54LV367AFK |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
40
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LV367AD
ACTIVE
16
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367ADBR
ACTIVE
SSOP
DB
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367ADBRE4
ACTIVE
SSOP
DB
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367ADE4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367ADGVR
ACTIVE
TVSOP
DGV
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367ADGVRE4
ACTIVE
TVSOP
DGV
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367ADR
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367ADRE4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367ANSR
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367ANSRE4
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367APWR
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367APWRE4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367APWT
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
SN74LV367APWTE4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 1
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