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参数资料
| 型号： | SP0516BBCT |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | BIDIRECTIONAL, 16 ELEMENT, SILICON, TVS DIODE |
| 封装： | 3.10 X 2.45 MM, CSP-20 |
| 文件页数： | 2/6页 |
| 文件大小： | 353K |
| 代理商： | SP0516BBCT |
TVS Diode Arrays
229
www .littelfuse .com
5
SILICON
PR
O
TECTION
CIRCUITS
SP0504BBC, SP0508BBC, SP0516BBC
TVS Avalanche Diode Array in a Bipolar Chip Scale Package
Electrical Specifications TA = 25°C Unless Otherwise Specified
PARAMETER
Reverse Standoff Voltage
Reverse Standoff Leakage Current
Signal Clamp Voltage
Positive
Negative
Clamp Voltage during ESD
MIL-STD-883D Method 3015
ESD Test Level
IEC-61000-4-2, Contact discharge
MIL-STD-883D Method 3015 (HBM)
Capacitance
Turn on/off Time
Temperature Range
Operating
Storage
TEST CONDITIONS
I = 10A
V = TBD
I = 10mA
8 kV Positive
8 kV Negative
2.5VDC @ 1Mhz
MIN
± 5.9
6.0
- 9.2
18
30
- 40
- 65
MAX
-
100
9.2
- 6.0
85
150
UNITS
V
nA
V
kV
pF
ns
°C
TYPICAL
-
7.6
- 7.6
14
-14
39
<1
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.350mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.360mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260
°C
.
Typical Solder Reflow Thermal Profile (No-Clean Flux)
0
48
97
Time (s)
145
194
242
290
339
387
435
EXH
CD
RF
Z
Z4
Z3
Z2
PH
EXH
250
225
200
175
150
125
100
75
50
25
T
emper
ature
(
o
C)
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相关代理商/技术参数 |
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