参数资料
| 型号： | SP1001-04XTG |
| 厂商： | Littelfuse Inc |
| 文件页数： | 2/7页 |
| 文件大小： | 0K |
| 描述： | TVS ARRAY ESD SIL 4CH SOT553 |
| 产品培训模块： | Transient Voltage Suppression (TVS) Diodes TVS Diode Array |
| 产品目录绘图： | SP0505 Series Circuit |
| 特色产品： | SP1000 Series Silicon Protection Arrays |
| 标准包装： | 1 |
| 系列： | SPA |
| 电压 - 反向隔离（标准值）： | 5.5V |
| 电压 - 击穿： | 6V |
| 电极标记： | 4 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-553 |
| 供应商设备封装： | SOT-553 |
| 包装： | 标准包装 |
| 产品目录页面： | 2375 (CN2011-ZH PDF) |
| 其它名称： | F2896DKR |
TVS Diode Arrays (SPA ? Diodes)
General Purpose ESD Protection - SP1001 Series
Absolute Maximum Ratings
Thermal Information
Symbol
I PP
T OP
Parameter
Peak Current (t p =8/20μs)
Operating Temperature
Value
2
–40 to 125
Units
A
°C
Parameter
Storage Temperature Range
Maximum Junction Temperature
Rating
–55 to 150
150
Units
°C
°C
T STOR Storage Temperature –55 to 150 °C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
Maximum Lead Temperature (Soldering
20s-40s)
260
°C
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (T OP = 25°C)
Parameter
Forward Voltage Drop
Reverse Voltage Drop
Reverse Standoff Voltage
Reverse Leakage Current
Clamp Voltage 1
Symbol
V F
V R
V RWM
I LEAK
V C
Test Conditions
I F =10mA
I R =1mA
I R ≤1μA
V R =5V
I PP =1A, t p =8/20μs, Fwd
I PP =2A, t p =8/20μs, Fwd
Min
0.7
6.0
Typ
0.9
8.0
9.7
Max
1.2
8.5
5.5
0.5
11.0
13.0
Units
V
V
V
μA
V
V
Dynamic Resistance
ESD Withstand Voltage 1,2
Diode Capacitance 1
R DYN
V ESD
C D
(V C2 - V C1 ) / (I PP2 - I PP1 )
IEC61000-4-2 (Contact)
IEC61000-4-2 (Air)
Reverse Bias=0V
Reverse Bias=2.5V
Reverse Bias=5V
±15
±30
1.7
12
8
7
Ω
kV
kV
pF
pF
pF
Notes:
1
2
Parameter is guaranteed by device characterization
A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Capacitance vs. Reverse Bias
14
12
10
8
6
4
2
0
Design Consideration
Because of the fast rise-time of the ESD transient,
placement of ESD devices is a key design consideration.
To achieve optimal ESD suppression, the devices should be
placed on the circuit board as close to the source of the ESD
transient as possible. Install the ESD suppressors directly
behind the connector so that they are the first board-level
circuit component encountered by the ESD transient. They
are connected from signal/data line to ground.
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
DC Bias (V)
? 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/10/13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SP1001-04XTG | 制造商:Littelfuse 功能描述:TVS Diode 制造商:Littelfuse 功能描述:DIODE, TVS, ESD PROTECTION, 12pF |
| SP1001-05JTG | 功能描述:TVS二极管阵列 5 channels RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP1001-05VTG | 功能描述:TVS二极管阵列 5 Ch 8KV 5V 8pF RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP1001-05XTG | 功能描述:TVS二极管阵列 5 channels RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP1001-05XTG | 制造商:Littelfuse 功能描述:ESD Protection Diode Array |
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