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参数资料
| 型号： | SP2526A-2EN-L/TR |
| 厂商： | Exar Corporation |
| 文件页数： | 7/9页 |
| 文件大小： | 0K |
| 描述： | IC USB PWR SW HI-SIDE DL 8NSOIC |
| 产品变化通告： | Bond Wire Change 23/Aug/2011 |
| 标准包装： | 2,500 |
| 系列： | * |
S P 2 5 2 6 A
D u a l C h a n n e l U S B P o w e r D i s t r i b u t i o n S w i t c h
APPLICATION INFORMATION
E RROR F LAG
An open-drained output of an N-channel
MOSFET, the FLG output is pulled low to signal
the following fault conditions: input
undervoltage, output current limit, and
thermal shutdown.
C URRENT L IMIT
The current limit threshold is preset internally.
It protects the output MOSFET switches from
damage resulting from undesirable short
circuit conditions or excess inrush current,
which is often encountered during hot plug-in.
The low limit of the current limit threshold of
the SP2526A allows a minimum current of
0.6A through the MOSFET switches. A current
limit condition will signal the Error Flag.
T HERMAL S HUTDOWN
When the chip temperature exceeds 135oC for
any reason other than overcurrent fault of
either one of the two MOSFETs, the thermal
shutdown function turns off both MOSFET
switches and signals the error flag. A
hysteresis of 10oC prevents the MOSFETs from
turning back on until the chip temperature
drops below 125oC. However, if thermal
shutdown is triggered by chip temperature rise
resulting from overcurrent fault condition of
either one of the MOSFET switches, the
thermal shutdown function will only turn off
the switch that is in overcurrent condition and
the other switch can still remain its normal
operation. In other words, the thermal
shutdown function of the two switches is
independent of each other in the case of
overcurrent fault.
S UPPLY F ILTERING
A 0.1 μ F to 1 μ F bypass capacitor from IN to
GND, located near the device, is strongly
recommended to control supply transients.
Without a bypass capacitor, an output short
may cause ringing on the input (from supply
lead inductance) which can damage internal
control circuitry.
T RANSIENT R EQUIREMENTS
USB supports dynamic attachment (hot
plugin) of peripherals. A current surge is
caused by the input capacitance of a
downstream device. Ferrite beads are
recommended in series with all power and
ground connector pins. Ferrite beads reduce
EMI and limit the inrush current during hot-
attachment by filtering high-frequency signals.
S HORT C IRCUIT T RANSIENT
Bulk capacitance provides the short-term
transient current needed during a hot-
attachment event. A 33 μ F/16V tantalum or a
100 μ F/10V electrolytic capacitor mounted
close to the downstream connector at each
port should provide sufficient transient drop
protection.
P RINTED C IRCUIT L AYOUT
The Power circuitry of USB printed circuit
boards requires a customized layout to
maximize thermal dissipation and to minimize
voltage drop and EMI.
TEST CIRCUIT
? 2011 Exar Corporation
7/9
Rev. 2.1.0
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SP2526AS32RG | 制造商:SYNC-POWER 制造商全称:SYNC-POWER 功能描述:Low ESR Cap. Compatible Positive Voltage Regulators |
| SP2526EB | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Evaluation Board Manual |
| SP2526EN-1 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:+3.0V to +5.5V USB Power Control Switch |
| SP2526EN-2 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:+3.0V to +5.5V USB Power Control Switch |
| SP2526EP-1 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:+3.0V to +5.5V USB Power Control Switch |
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