- 您现在的位置：买卖IC网 > PDF目录372174 > SP3220EB Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C PDF资料下载
参数资料
| 型号： | SP3220EB |
| 元件分类： | 外设及接口 |
| 英文描述： | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| 中文描述： | 电可擦除可编程逻辑器件 |
| 文件页数： | 12/19页 |
| 文件大小： | 160K |
| 代理商： | SP3220EB |
Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers
Copyright 2002 Sipex Corporation
12
Phase 4
— V
transfer — The fourth phase of the clock
connects the negative terminal of C
to GND,
and transfers this positive generated voltage
across C
to C
, the V
storage capacitor. This
voltage is regulated to +5.5V. At this voltage,
the internal oscillator is disabled. Simultaneous
with the transfer of the voltage to C
, the positive
side of capacitor C
is switched to V
and the
negative side is connected to GND, allowing the
charge pump cycle to begin again. The charge
pump cycle will continue as long as the
operational conditions for the internal oscillator
are present.
Since both V
+
and V
–
are separately generated
from V
; in a no–load condition V
+
and V
–
will
be symmetrical. Older charge pump approaches
that generate V
–
from V
+
will show a decrease in
the magnitude of V
–
compared to V
+
due to the
inherent inefficiencies in the design.
The clock rate for the charge pump typically
operates at 250kHz. The external capacitors can
be as low as 0.1
μ
F with a 16V breakdown
voltage rating.
ESD Tolerance
The
SP3220EB/EU
device incorporates rugge-
dized ESD cells on all driver output and receiver
input pins. The ESD structure is improved over
our previous family for more rugged applications
and environments sensitive to electro-static
discharges and associated transients. The im-
proved ESD tolerance is at least ±15kV without
damage nor latch-up.
There are different methods of ESD testing applied:
a) MIL-STD-883, Method 3015.7
b)IEC1000-4-2 Air Discharge
c)IEC1000-4-2 Direct Contact
The Human Body Model has been the generally
accepted ESD testing method for semiconductors.
This method is also specified in MIL-STD-883,
Method 3015.7 for ESD testing. The premise of
this ESD test is to simulate the human body’s
potential to store electro-static energy and
discharge it to an integrated circuit. The
simulation is performed by using a test model as
shown in
Figure 20
. This method will test the
IC’s capability to withstand an ESD transient
during normal handling such as in manufacturing
areas where the ICs tend to be handled
frequently.
The IEC-1000-4-2, formerly IEC801-2, is gen-
erally used for testing ESD on equipment and
system manufacturers, they must guarantee a
certain amount of ESD protection since the
system itself is exposed to the outside enviroment
and human presence. The premise with IEC1000-
4-2 is that the system is required to withstand an
amount of static electricity when ESD is applied
to points and surfaces of the equipment that are
accesible to personnel during normal usage.
The transceiver IC receives most of the ESD
current when the ESD source is applied to the
connector pins. The test circuit for IEC-1000-4-
2 is shown in
Figure 21
. There are two methods
within IEC-4-2, the Air Discharge method and
the Contact Discharge method.
With the Air Discharge Method, an ESD voltage
is applied to the equipment under test (EUT)
trough air. This simulates an electrically charged
person ready to connect a cable onto the rear of
the system only to find an unpleasent zap just
before the person touches the back panel. The
high energy potential on the person discharges
through an arcing path to the rear panel system
before he or she even touches the system. This
energy, weather discharged directly or through air,
is predominantly a function of the discharge cur-
rent rather than the discharge voltage.
Variables with an air discharge such as ap-
proach speed of the object carrying the ESD
potential to the system and humidity will tend to
change the discharge current. For example, the
rise time of the discharge current varies with the
approach speed.
相关PDF资料 |
PDF描述 |
|---|---|
| SP3220EBCT | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| SP3220EBCY | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| SP3220EBEA | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| SP3220EBET | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| SP3220EBEY | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SP3220EBCA | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:High Speed +3.0V to +5.5V RS-232 Driver/Receiver Pair |
| SP3220EBCA-L | 功能描述:RS-232接口集成电路 3V-5.5V RS-232 1-DRV/1-RCV LOW PWR RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| SP3220EBCA-L/TR | 功能描述:RS-232接口集成电路 3V-5.5V RS-232 1-DRV/1-RCV LOW PWR RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| SP3220EBCA-LTR | 制造商:EXAR 制造商全称:EXAR 功能描述:3.0V to 5.5V RS-232 Driver/Receiver Pair |
| SP3220EBCT | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:High Speed +3.0V to +5.5V RS-232 Driver/Receiver Pair |
发布紧急采购，3分钟左右您将得到回复。