参数资料
型号: SP6644EU-L
厂商: Exar Corporation
文件页数: 11/15页
文件大小: 0K
描述: IC REG BOOST SYNC 3.3V/ADJ 8MSOP
标准包装: 50
类型: 升压(升压)
输出类型: 两者兼有
输出数: 1
输出电压: 3.3V,2 V ~ 5.5 V
输入电压: 0.9 V ~ 3.3 V
电流 - 输出: 175mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
包装: 管件
供应商设备封装: 8-MSOP
其它名称: 1016-1213-5
22 μ H
0.7A
0.88V to
3.3V Input
22 μ F
0.1 μ F
R LIM
V BATT
LX
V OUT
V OUT =
2V to 5.2V
SP6644
SP6645
100pF*
R1
47 μ F
BATTLO
*optional compensation
SHDN
GND
Figure 28. Adjustable Output Voltage Circuitry
With an external resistor tolerance of +1%, the
peak current tolerance will be +6%. To make
sure that the SP6644/6645 internal circuitry
adequately controls the inductor current, it is
recommended that values equal to or greater
than 22 μ H (+10%) be used.
The SP6644/6645 devices control algorithm
delivers an average maximum load current in
regulation as defined by:
FB
R2
APPLICATION NOTES
Printed circuit board layout is a critical part of
design. Poor designs can result in excessive EMI
on the voltage gradients and feedback paths on
the ground planes with applications involving
high switching frequencies and large peak
currents. Excessive EMI can result in instability
or regulation errors.
I LOAD-MAX =
E x I PEAK x V BATT
2 x V OUT
All power components should be placed on the
PC board as closely as possible with the traces
kept short, direct, and wide (>50mils or 1.25mm).
where I LOAD-MAX [A] is the maximum load current,
E is the efficiency factor (generally between 0.8
and 0.9), I PEAK [A] is the programmed peak
inductor current, V BATT [V] is the input voltage to
the device, and V OUT [V] is the output voltage.
Given the minimum input voltage, output voltage,
and maximum average load current, the value of
I PEAK can be solved for and an appropriate inductor
can be chosen. It is good design practice to use
the lowest peak current possible to
reduce possible EMI and output ripple voltage.
A closed-core inductor, such as a toroid or
shielded bobbin, will minimize any fringe
magnetic fields or EMI.
Extra copper on the PC board should be integrated
into ground as a pseudo-ground plane. On a
multilayer PC board, route the star ground using
component-side copper fill, then connect it to the
internal ground plane using vias.
For the SP6644/6645 devices, the inductor and
input and output filter capacitors should
be soldered with their ground pins as close
together as possible in a star-ground
configuration. The V OUT pin must be bypassed
directly to ground as close to the SP6644/6645
devices as possible (within 0.2in or 5mm). The
DC-DC converter and any digital circuitry should
be placed on the opposite corner of the PC board
as far away from sensitive RF and analog input
stages. The external voltage-feedback network
should be placed very close to the FB pin as well
as the R LIM resistor (within 0.2in or 5mm). Any
Date: 11/30/04
SP6644/6645 High Efficiency Boost Regulator
11
? Copyright 2004 Sipex Corporation
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