参数资料
| 型号： | SP721ABT |
| 厂商： | Littelfuse Inc |
| 文件页数： | 6/6页 |
| 文件大小： | 0K |
| 描述： | TVS ARRAY ESD 6 INPUT 8-SOIC |
| 标准包装： | 2,500 |
| 系列： | SP721 |
| 电压 - 工作： | 30V |
| 技术： | 混合技术 |
| 电路数： | 6 |
| 应用： | 通用 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 带卷 (TR) |
TVS Diode Arrays
Electronic Protection Array for ESD and Overvoltage Protection
SP721
Small Outline Plastic Packages (SOIC)
M8.15
(JEDEC MS-012-AA ISSUE C)
N
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
E
-B-
H
0.25(0.010) M
B M
SYMBOL
A
INCHES
MIN MAX
0.0532
0.0688
MILLIMETERS
MIN MAX
1.35
1.75
NOTES
-
A1
0.0040
0.0098
0.10
0.25
-
1
2
3
L
B
0.013
0.020
0.33
0.51
9
SEATING PLANE
C
0.0075
0.0098
0.19
0.25
-
-A-
D
A
h x 45 o
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
-C-
e
0.050 BSC
1.27 BSC
-
e
B
0.25(0.010) M
C A M
B S
A1
μ
0.10(0.004)
C
H
h
L
0.2284
0.0099
0.016
0.2440
0.0196
0.050
5.80
0.25
0.40
6.20
0.50
1.27
-
5
6
N
8
8
7
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
μ
0 o
8 o
0 o
8 o
-
5
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
w w w. l i t t e l f u s e . c o m
239
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相关代理商/技术参数 |
参数描述 |
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| SP721ABTG | 功能描述:TVS二极管阵列 6 CH DIODE ARRAY RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP721ABTG | 制造商:Littelfuse 功能描述:Diode |
| SP721ABTG-CUT TAPE | 制造商:LITTELFUSE 功能描述:SP721 Series 3 pF Surface Mount SCR & Diode Rail Clamp Array - SOIC-8 |
| SP721AP | 功能描述:TVS二极管阵列 SP721AP RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP721APG | 制造商:LITTELFUSE 制造商全称:Littelfuse 功能描述:SP721 Series 3pF 4kV Diode Array |
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