参数资料
| 型号： | SP721APP |
| 厂商： | Littelfuse Inc |
| 文件页数： | 5/6页 |
| 文件大小： | 0K |
| 描述： | TVS ARRAY ESD 6 INPUT 8-DIP |
| 产品培训模块： | Transient Voltage Suppression (TVS) Diodes TVS Diode Array |
| 产品目录绘图： | SP72 Series Circuit |
| 标准包装： | 500 |
| 系列： | SP721 |
| 电压 - 工作： | 30V |
| 技术： | 混合技术 |
| 电路数： | 6 |
| 应用： | 通用 |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
| 产品目录页面： | 2374 (CN2011-ZH PDF) |
| 其它名称： | F2720 |
TVS Diode Arrays (SPA ? Diodes)
General Purpose ESD Protection - SP721 Series
Soldering Parameters
Reflow Condition
- Temperature Min (T s(min) )
Pre Heat - Temperature Max (T s(max) )
- Time (min to max) (t s )
Average ramp up rate (Liquidus) Temp
(T L ) to peak
T S(max) to T L - Ramp-up Rate
Pb – Free assembly
150°C
200°C
60 – 180 secs
5°C/second max
5°C/second max
T P
T L
T S(max)
T S(min)
t S
Ramp-up
Preheat
t P
t L
Critical Zone
T L to T P
Ramp-down
Reflow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
25
time to peak temperature
Time
Peak Temperature (T P )
Time within 5°C of actual peak
Temperature (t p )
Ramp-down Rate
Time 25°C to peak Temperature (T P )
Do not exceed
260 +0/-5 °C
20 – 40 seconds
5°C/second max
8 minutes Max.
260°C
Package Dimensions — Dual-In-Line Plastic Packages (PDIP)
N
Package
PDIP
INDEX
AREA
1 2 3
N/2
E1
-B-
Pins
JEDEC
8 Lead Dual-in-Line
MS-001
A
A 1
e
-A-
BASE
PLANE
SEATING
PLANE
D1
B1
B
D
A2
-C-
L
D1
e C
0.010 (0.25) M C A B S
E
CL
e A
C
e B
A
A1
A2
B
B1
C
Millimeters
Min Max
- 5.33
0.39 -
2.93 4.95
0.356 0.558
1.15 1.77
0.204 0.355
Inches
Min Max
- 0.210
0.015 -
0.115 0.195
0.014 0.022
0.045 0.070
0.008 0.014
Notes
4
4
-
-
8, 10
-
2. Dimensioningand tolerancingper ANSI Y14.5M-1982.
2.2 of PublicationNo. 95.
4. Dimensions DimensionsA, L are measured measured withthe package seated seating plane
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensionsdo not includemold?ash or protru-
sions. Mold ?ash or protrusionsshall not exceed 0.010 inch
e B and e E C are measured at measured tips with the leads unconstrained. e per-
and e A are the lead withthe leads constrainedto be C must be zero
6.
pendicularto datum -C- .
7. e B and e are measuredat the lead tips withthe leads uncon-
strained.e C must be zero or greater.
8. B1 maximumdimensionsdo not includedambarprotrusions.
9. N is the maximumnumberof terminalpositions.
Notes: NOTES:
1. INCH. In case of In case of con?ict English and
1. Controlling ControllingDimensions: INCH. conflict between between Metric
English inch control.
dimensions, the and Metricdimensions,the inch dimensionscontrol.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
defined the “MO the Symbol in Section in 3. 2.2 of
3. Symbols Symbolsare de?nedin Series “MOSeries SymbolList” Section Publication No.
95.
gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.010 inch (0.25mm).
A are measured
6. E and e (0.25mm). with the leads constrained to be perpendicular to datum -C- .
7.
or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall
not exceed 0.010 C inch (0.25mm).
9. N is t he maximum number of terminal positions.
leads (1, N, N/2 and N/2 + 1) for E8.3, 0.010 E28.3, E42.6 inch
10. Corner Dambar protrusionsshall not exceed E16.3, E18.3, (0.25mm). will have a B1
dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
D
D1
E
E1
e
e A
e B
L
N
9.01 10.16
0.13 -
7.62 8.25
6.10 7.11
2.54 BSC
7.62 BSC
- 10.92
2.93 3.81
8
0.355 0.400
0.005 -
0.300 0.325
0.240 0.280
0.100 BSC
0.300 BSC
- 0.430
0.115 0.150
8
5
5
6
5
-
6
7
4
9
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimensionof 0.030 - 0.045 inch
(0.76 - 1.14mm).
? 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
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相关代理商/技术参数 |
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| SP721APP | 制造商:Littelfuse 功能描述:TVS DIODE ARRAY |
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