参数资料
型号: SP723ABTG
厂商: Littelfuse Inc
文件页数: 5/6页
文件大小: 0K
描述: TVS ARRAY ESD 6 INPUT 8-SOIC
产品培训模块: Transient Voltage Suppression (TVS) Diodes
TVS Diode Array
产品目录绘图: SP72 Series Circuit
标准包装: 1
系列: SP723
电压 - 工作: 30V
技术: 混合技术
电路数: 6
应用: 通用
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 标准包装
产品目录页面: 2374 (CN2011-ZH PDF)
其它名称: F3164DKR
TVS Diode Arrays (SPA ? Diodes)
General Purpose ESD Protection - SP723 Series
Soldering Parameters
Reflow Condition
- Temperature Min (T s(min) )
Pre Heat - Temperature Max (T s(max) )
- Time (min to max) (t s )
Average ramp up rate (Liquidus) Temp
(T L ) to peak
T S(max) to T L - Ramp-up Rate
Pb – Free assembly
150°C
200°C
60 – 180 secs
5°C/second max
5°C/second max
T P
T L
T S(max)
T S(min)
t S
Ramp-up
Preheat
t P
t L
Critical Zone
T L to T P
Ramp-down
Reflow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
25
time to peak temperature
Time
Peak Temperature (T P )
Time within 5°C of actual peak
Temperature (t p )
Ramp-down Rate
Time 25°C to peak Temperature (T P )
Do not exceed
260 +0/-5 °C
20 – 40 seconds
5°C/second max
8 minutes Max.
260°C
Package Dimensions — Dual-In-Line Plastic Packages (PDIP)
INDEX
AREA
N
1 2 3
N/2
E1
Package
Pins
PDIP
8
-B-
JEDEC
MS-001
-A-
BASE
PLANE
SEATING
PLANE
D
-C-
A2
L
A
E
CL
A
A1
Millimeters
Min Max
- 5.33
0.39 -
Inches
Min Max
- 0.210
0.015 -
Notes
4
4
A 1
e
D1
B1
B
D1
e C
0.010 (0.25) M C A B S
e A
C
e B
A2
B
B1
2.93
0.356
1.15
4.95
0.558
1.77
0.115
0.014
0.045
0.195
0.022
0.070
-
-
8, 10
1. Controlling English Dimensions: Metricdimensions, the conflict dimensionscontrol. Metric dimensions,
3. Symbolsare de?nedin the “MOSeries SymbolList”in Section
in JEDEC seating plane gauge GS-3.
-C- 6. E and e
A are measuredwiththe leads constrainedto be per-
8. B1 maximumdimensionsdo not includedambarprotrusions.
NOTES:
Notes:
1. ControllingDimensions:INCH. In case of con?ictbetween
the inch dimensions control.
2. Dimensioningand tolerancingper ANSI Y14.5M-1982.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2.2 of defined the No. 95.
4. A1 and L are L with the package seated in JEDEC
3. Symbols are Publication “MO Series Symbol List” in Section 2.2 of Publication No. 95.
4. Dimensions DimensionsA, A1 and measured measured withthe package seated seating plane
gauge GS-3.
5. D, E1 and E1 not do not flash or Mold
5. D, D1, and D1, dimensions dimensions include includemold?ash protrusions. protru- flash or
sions. not ?ash or 0.010 inch (0.25mm).
protrusions shall Mold exceed protrusionsshall not exceed 0.010 inch
e A are
6. E and (0.25mm). measured with the leads unconstrained to be perpendicular to datum
.
C measured -C- .
7. e B and pendicularto datum the lead tips with the leads uncon-strained. e C must be zero or
7.
greater. B and e C are measuredat the lead tips withthe leads uncon-
maximum C must do not or include dambar
8. B1 strained.e dimensions be zero greater. protrusions. Dambar protrusions shall not
exceed 0.010 inch (0.25mm).
Dambar number of shall not exceed 0.010
9. N is the maximum protrusions terminal positions. inch (0.25mm).
C
D
D1
E
E1
e
e A
e B
L
N
0.204 0.355
9.01 10.16
0.13 -
7.62 8.25
6.1 7.11
2.54 BSC
7.62 BSC
- 10.92
2.93 3.81
8
0.008 0.014
0.355 0.400
0.005 -
0.300 0.325
0.240 0.280
0.100 BSC
0.300 BSC
- 0.430
0.115 0.150
8
-
5
5
6
5
-
6
7
4
9
N is (1, N, N/2 and N/2 + 1) 9. for E8.3, E16.3, E18.3,
10. Corner leads the maximumnumber of terminalpositions. E28.3, E42.6 will have a B1
10. of 0.030 - (1, N, N/2 and - + for
dimension Corner leads 0.045 inch (0.76 N/2 1.14mm). E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimensionof 0.030 - 0.045 inch
(0.76 - 1.14mm).
? 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
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