参数资料
| 型号： | SP724AHTG |
| 厂商： | Littelfuse Inc |
| 文件页数： | 5/6页 |
| 文件大小： | 0K |
| 描述： | TVS ARRAY ESD 4 INPUT SOT-23 |
| 产品培训模块： | Transient Voltage Suppression (TVS) Diodes TVS Diode Array |
| 产品目录绘图： | SP72 Series Circuit |
| 标准包装： | 3,000 |
| 系列： | SP724 |
| 电压 - 工作： | 20V |
| 技术： | 混合技术 |
| 电路数： | 4 |
| 应用： | 通用 |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-23-6 |
| 包装： | 标准包装 |
| 产品目录页面： | 2374 (CN2011-ZH PDF) |
| 其它名称： | F2863DKR |
TVS Diode Arrays (SPA ? Diodes)
General Purpose ESD Protection - SP724 Series
Soldering Parameters
Reflow Condition
- Temperature Min (T s(min) )
Pre Heat - Temperature Max (T s(max) )
- Time (min to max) (t s )
Average ramp up rate (Liquidus) Temp
(T L ) to peak
T S(max) to T L - Ramp-up Rate
Pb – Free assembly
150°C
200°C
60 – 180 secs
5°C/second max
5°C/second max
T P
T L
T S(max)
T S(min)
t S
Ramp-up
Preheat
t P
t L
Critical Zone
T L to T P
Ramp-down
Reflow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
25
time to peak temperature
Time
Peak Temperature (T P )
Time within 5°C of actual peak
Temperature (t p )
Ramp-down Rate
Time 25°C to peak Temperature (T P )
Do not exceed
260 +0/-5 °C
20 – 40 seconds
5°C/second max
8 minutes Max.
260°C
Package Dimensions — Small Outline Transistor Plastic Packages (SOT23-6)
Package
Pins
JEDEC
SOT23-6
6
MO-178
Millimeters
Min Max
Min
Inches
Max
Notes
A
A1
A2
b
C
D
E
E1
0.900
0.000
0.900
0.350
0.080
2.800
2.600
1.500
1.450
0.150
1.300
0.500
0.220
3.000
3.000
1.750
0.035
0.000
0.035
0.0138
0.0031
0.11
0.102
0.06
0.057
0.006
0.051
0.0196
0.009
0.118
0.118
0.069
-
-
-
-
-
3
-
3
e
e1
0.95 Ref
1.9 Ref
0.0374 ref
0.0748 Ref
-
-
L
0.100
0.600
0.004
0.023
4,5
Recommended Solder Pad Layout
N
a
0o
6
10o
0o
6
10o
6
-
M
O
P
R
2.590
0.690
0.990
0.950
0.102
.027 TYP
.039 TYP
0.038
-
-
-
-
P
O
? 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
R
M
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
相关PDF资料 |
PDF描述 |
|---|---|
| SP724AHT | TVS ARRAY ESD 4 INPUT SOT-23 |
| SPC02SVDN-RC | CONN JUMPER SHORTING .100" GOLD |
| SPC02SVGN-RC | CONN JUMPER SHORTING .100" GOLD |
| SPC02SVJN-RC | CONN JUMPER SHORTING .100" GOLD |
| SPC02SVKN-RC | CONN JUMPER SHORTING .100" GOLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SP724AHTG | 制造商:Littelfuse 功能描述:TVS ARRAYESD4 INPUTSOT23-6 |
| SP724AHTG-CUT TAPE | 制造商:LITTELFUSE 功能描述:SP724 Series 3 pF Surface Mount SCR & Diode Rail Clamp Array - SOT-23-6 |
| SP724AHTP | 功能描述:TVS二极管阵列 20V 2.2A RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP724AHTP | 制造商:Littelfuse 功能描述:TVS Diode Array |
| SP725 | 制造商:LITTELFUSE 制造商全称:Littelfuse 功能描述:Lead-Free/Green Series |
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