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参数资料
| 型号： | SP7651EB |
| 厂商： | Exar Corporation |
| 文件页数： | 11/15页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD FOR SP7651 |
| 标准包装： | 1 |
| 系列： | * |
APPLICATIONS INFORMATION
SP765X Thermal Resistance
The SP765X family has been tested with a
variety of footprint layouts along with differ-
ent copper area and thermal resistance has
been measured. The layouts were done on
4 layer FR4 PCB with the top and bottom
layers using 3oz copper and the power and
ground layers using oz copper.
For the Minimum footprint, only about 0.
square inch of 3 ounces of copper was
used on the top or footprint layer, and this
layer had no vias to connect to the 3 other
layers. For the Medium footprint, about 0.7
square inches of 3 ounces of copper was
used on the top layer, but vias were used
to connect to the other 3 layers. For the
Maximum footprint, about .0 square inch
of 3 ounces of copper was used on the top
layer and many vias were used to connect
to the 3 other layers.
The results show that only about 0.7 square
inches of 3 ounces of copper on the top
layer and vias connecting to the 3 other
layers are needed to get the best thermal
resistance of 36°C/W. Adding area on the
top beyond the 0.7 square inches did not
reduce thermal resistance.
Using a minimum of 0. square inches of
(3 ounces of) Copper on the top layer with
no vias connecting to the 3 other layers
produced a thermal resistance of 44°C/W.
This thermal impedance is only 22% higher
than the medium and large footprint layouts,
indicating that space constrained designs
can still benefit thermally from the Powerblox
family of ICs. This indicates that a minimum
footprint of 0. square inch, if used on a
4 layer board, can produce 44°C/W ther -
mal resistance. This approach is still very
worthwhile if used in a space constrained
design.
The following page shows the footprint
layouts from an ORCAD file. The thermal
data was taken for still air, not with
forced air. If forced air is used, some
improvement in thermal resistance
would be seen.
SP765X Thermal Resistance
4 Layer Board:
Top Layer 3ounces Copper
GND Layer 1ounce Copper
Power Layer ounce Copper
Bottom Layer 3ounces Copper
Minimum Footprint: 44°C/W
Top Layer: 0. square inch
No Vias to other 3 Layers
Medium Footprint: 36°C/W
Top Layer: 0.7 square inch
Vias to other 3 Layers
Maximum Footprint: 36°C/W
Top Layer: .0 square inch
Vias to other 3 Layers
Rev J: 3/ 4/07
SP765 Wide Input Voltage Range 3A, 900kHz, Buck Regulator
? Copyright 2007 Sipex Corporation
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| SP7651ER | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Evaluation Board Manual |
| SP7651ER/TR | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range 3A, 900kHz, Buck Regulator |
| SP7651ER-L | 功能描述:DC/DC 开关控制器 Buck Regulator RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| SP7651ER-L/TR | 功能描述:开关变换器、稳压器与控制器 WIDE INPUT VOLTAGE RANGE, 3A 900k RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| SP7652 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range 6A, 600kHz, Buck Regulator |
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