参数资料
型号: SP8126CB-3/TR
元件分类: 光电元器件
英文描述: LINEAR OUTPUT PHOTO DETECTOR
封装: 3 X 3.50 MM, COB, 8 PIN
文件页数: 5/8页
文件大小: 91K
代理商: SP8126CB-3/TR
5
Rev:B Date: 3/18/04
SP8126B High Speed Differential APC Amplifier
Copyright 2004 Sipex Corporation
A major consideration in developing the optical
pick-up head system is the extremely small form
factor, which is additionally aggravated by the
physical locations required by the light path.
Special care must be taken when designing the
Flex or PCB for this part. The output peak
current requirement is in the order of 12.5mA
when driving 50pF of capacitive load with a
slew rate of 250V/
s Therefore care must be
taken to provide low inductance, low resistance
paths for power and ground and output traces.
Supply coupling is also very important. Good
supply decoupling is important to ensure the
high frequency performance of the system by
eliminating supply lead inductance effects. The
decoupling capacitor C1, as shown in Figure 5,
should be as close to the part as possible. This
Figure 4. Test and Evaluation PCB Layout for COB 8 Lead Package
Top
Bottom
capacitor should be 0.1
F ceramic. C2 is op-
tional to improve decoupling and is recom-
mended to be 1
F tantalum. The layout of the
PCB is pictured here. Note the wide and short
traces on the supply lines.
The traces for the gain resistors RGAIN1 and
RGAIN2 are kept as short as possible to avoid
excessive parasitics. Any parasitics on these
nodes will limit the performance of the system.
RGAIN1 and RGAIN2 are subminiature potentiom-
eters in the application. This is a single layer
board using FR4 material.
In order to minimize coupling capacitance into
the gain setting resistor nodes, it is also critical
that VOUT+ and VOUT- are routed away from the
traces associated with the gain-setting resistors.
LAYOUT AND ROUTING CONSIDERATIONS
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