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参数资料
| 型号： | SPC5553MVZ132 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 14/54页 |
| 文件大小： | 0K |
| 描述： | MCU POWERPC 132MHZ 324-PBGA |
| 标准包装： | 60 |
| 系列： | MPC55xx Qorivva |
| 核心处理器： | e200z6 |
| 芯体尺寸： | 32-位 |
| 速度： | 132MHz |
| 连通性： | CAN，EBI/EMI，以太网，SCI，SPI |
| 外围设备： | DMA，POR，PWM，WDT |
| 输入/输出数： | 220 |
| 程序存储器容量： | 1.5KB（1.5K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 64K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.35 V ~ 1.65 V |
| 数据转换器： | A/D 40x12b |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 324-BBGA |
| 包装： | 托盘 |
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Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 3
Freescale Semiconductor
21
2.2
Thermal Characteristics
2.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the chip junction temperature, T
J
, can be obtained from the equation:
TJ = TA + (RθJA × PD)
Eqn. 1
where:
TA = ambient temperature for the package (
oC)
Eqn. 2
RθJA = junction to ambient thermal resistance (
oC/W)
Eqn. 3
PD = power dissipation in the package (W)
Eqn. 4
The supplied thermal resistances are provided based on JEDEC JESD51 series of standards to provide consistent values for
estimations and comparisons. The difference between the values determined on the single-layer (1s) board and on the four-layer
board with two signal layers and a power and a ground plane (2s2p) clearly demonstrate that the effective thermal resistance of
Table 4. Thermal Characteristics
Num
Characteristic
Symbol Unit
Value
208 MAPBGA
176 LQFP
144 LQFP
1
Junction to Ambient 1, 2
Natural Convection
(Single layer board)
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
RθJA
°C/W
44
38
43
2
Junction to Ambient 1, 3
Natural Convection
(Four layer board 2s2p)
3 Per JEDEC JESD51-6 with the board horizontal.
RθJA
°C/W
27
31
34
3
Junction to Ambient 1, 3
(@200 ft./min., Single layer board)
RθJMA °C/W
35
30
34
4
Junction to Ambient 1, 3
(@200 ft./min., Four layer board 2s2p)
RθJMA °C/W
24
25
28
5
Junction to Board 4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RθJB
°C/W
16
20
22
6
Junction to Case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RθJC
°C/W
8
6
7
Junction to Package Top 6
Natural Convection
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
Ψ
JT
°C/W
2
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相关代理商/技术参数 |
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|---|---|
| SPC5553MVZ132R | 制造商:Freescale Semiconductor 功能描述:MOCCASIN REV A 324 PBGA - Tape and Reel |
| SPC5553MVZ132R2 | 制造商:Freescale Semiconductor 功能描述:MOCCASIN REV A 324 PBGA - Tape and Reel |
| SPC5553MVZ80 | 制造商:Freescale Semiconductor 功能描述:MOCCASIN 324 - LEADFREE - Trays |
| SPC5553MZP132 | 制造商:Freescale Semiconductor 功能描述: 制造商:Freescale Semiconductor 功能描述:MOCCASIN REVA 416 TEPBGA - Trays |
| SPC5553MZP132R | 制造商:Freescale Semiconductor 功能描述:MOCCASIN REVA 416 TEPBGA - Tape and Reel |
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