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参数资料
| 型号： | SPC5668GF0AVMJ |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 116 MHz, MICROCONTROLLER, PBGA256 |
| 封装： | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MAPBGA-256 |
| 文件页数： | 22/66页 |
| 文件大小： | 593K |
| 代理商： | SPC5668GF0AVMJ |
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Electrical Characteristics
MPC5668x Microcontroller Data Sheet, Rev. 5
Freescale Semiconductor
29
device. This description is most useful for packages with heat sinks where some 90% of the heat flow is through the case to the
heat sink to ambient. For most packages, a better model is required.
A more accurate two-resistor thermal model can be constructed from the junction to board thermal resistance and the junction
to case thermal resistance. The junction to case covers the situation where a heat sink will be used or where a substantial amount
of heat is dissipated from the top of the package. The junction to board thermal resistance describes the thermal performance
when most of the heat is conducted to the printed circuit board. This model can be used for either hand estimations or for a
computational fluid dynamics (CFD) thermal model.
To determine the junction temperature of the device in the application after prototypes are available, the Thermal
Characterization Parameter (
JT) can be used to determine the junction temperature with a measurement of the temperature at
the top center of the package case using the following equation:
TJ =TT +(JT PD)
Eqn. 4
where:
TT = thermocouple temperature on top of the package (
oC)
JT = thermal characterization parameter (
oC/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
1.
C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2.
G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications,” Electronic
Packaging and Production, pp. 53–58, March 1998.
3.
B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application
in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SPC5668GF0AVMJR | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC5668x Microcontroller Data Sheet |
| SPC5668GF1AMMG | 功能描述:32位微控制器 - MCU 32B,2M NVM, GATEWAY RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5668GF1AMMGR | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC5668x Microcontroller Data Sheet |
| SPC5668GF1AVMG | 功能描述:32位微控制器 - MCU 32BIT2M NVM GATEWAY RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5668GF1AVMGR | 功能描述:32位微控制器 - MCU 32BIT,2M NVM, GWAY RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
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