参数资料
| 型号： | SPX1117T-L-3-3/TR |
| 厂商： | Exar Corporation |
| 文件页数： | 6/11页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V .8A TO263-3 |
| 标准包装： | 500 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.3V |
| 输入电压： | 最高 15V |
| 电压 - 压降（标准）： | 1.1V @ 800mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 800mA |
| 电流 - 限制（最小）： | 1A |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-263-4，D²Pak（3 引线+接片），TO-263AA |
| 供应商设备封装： | TO-263-3 |
| 包装： | 带卷 (TR) |
S P X 1 1 1 7
8 0 0 m A L o w D r o p o u t V o l t a g e R e g u l a t o r
APPLICATION INFORMATION
O UTPUT C APACITOR
To ensure the stability of the SPX1117, an
output capacitor of at least 2.2 μ F (tantalum or
ceramic) or 10μF (aluminum) is required. The
value may change based on the application
requirements of the output load or
temperature range. The value of ESR can vary
based on the type of capacitor used in the
applications to guarantee
stability. The
recommended value for ESR is 0.5 ? ? or less. A
larger value of output capacitance (up to
100μF) can improve the load transient
response.
Fig. 16: Load Step Response 0mA to 800mA
V IN =3.3V, V OUT =1.8V, C IN =10μF, C OUT =2.2μF, Ceramic
Signal 1=V OUT , Signal 4=I LOAD
Fig. 17: Load Step Response 0mA to 800mA
V IN =3.3V, V OUT =1.8V, C IN =10μF, C OUT =2.2μF, OSCON
Signal 1=V OUT , Signal 4=I LOAD
Fig. 18
S OLDERING M ETHODS
The SPX1117 SOT-223 package is designed to
be compatible with infrared reflow or vapor-
phase reflow soldering techniques. During
soldering, the non-active or mildly active
fluxes may be used. The SPX1117 die is
attached to the heatsink lead which exits
opposite the input, output, and ground pins.
Hand soldering and wave soldering should be
avoided since these methods can cause
damage to the device with excessive thermal
gradients on the package. The SOT-223
recommended soldering method are as
follows: vapor phase reflow and infrared
reflow with the component preheated to within
65 ? C of the soldering temperature range.
T HERMAL C HARACTERISTICS
The thermal resistance of SPX1117 (SOT-223
package) is 15°C/W from junction to tab and
31°C/W from tab to ambient for a total of 46
°C/W from junction to ambient (Table 1). The
SPX1117 features the internal thermal limiting
to protect the device during overload
conditions. Special care needs to be taken
during continuous load conditions such that
the maximum junction temperature does not
exceed 125 °C. Thermal protection is activated
at >155°C and deactivated at <140 °C.
Taking the FR-4 printed circuit board and 1/16
thick with 1 ounce copper foil as an
experiment (fig.19), the PCB material is
effective at transmitting heat with the tab
attached to the pad area and a ground plane
? 2011 Exar Corporation
6/11
Rev. 2.1.0
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SPX1117U | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:800mA Low Dropout Regulator |
| SPX1117U-1.5 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:800mA Low Dropout Voltage Regulator |
| SPX1117U-1.8 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:800mA Low Dropout Voltage Regulator |
| SPX1117U-1-5 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:800mA Low Dropout Voltage Regulator |
| SPX1117U-1-8 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:800mA Low Dropout Voltage Regulator |
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