参数资料
型号: SPX2810T-L/TR
元件分类: 可调正电压单路输出LDO稳压器
英文描述: 1.25 V-10 V ADJUSTABLE POSITIVE LDO REGULATOR, 1.2 V DROPOUT, PSSO3
封装: LEAD FREE, TO-263AA, 3 PIN
文件页数: 8/13页
文件大小: 106K
代理商: SPX2810T-L/TR
4
Date: 9/8/04
SPX2810 / SPX2810A 1A Low Dropout Linear Regulator
Copyright 2004 Sipex Corporation
Output Capacitor
To ensure the stability of the SPX1202, an
output capacitor of at least 10
F (tantalum or
ceramic) or 50
F (aluminum) is required. The
value may change based on the application
requirements of the output load or temperature
range. The value of ESR can vary based on the
type of capacitor used in the applications. The
recommended value for ESR is 0.5
or less. A
larger value of output capacitance (up to 100
F)
can improve the load transient response.
SOLDERING METHODS
The SPX2810 SOT-223 package is designed to
be compatible with infrared reflow or vapor-
phase reflow soldering techniques. During sol-
dering, the non-active or mildly active fluxes
may be used. The SPX2810 die is attached to
the heatsink lead which exits opposite the input,
output, and ground pins.
Hand soldering and wave soldering should be
avoided since these methods can cause damage
to the device with excessive thermal gradients
on the package. The SOT-223 recommended
soldering method are as follows: vapor phase
reflow and infrared reflow with the component
preheated to within 65
°C of the soldering tem-
perature range.
THERMAL CHARACTERISTICS
The thermal resistance of SPX2810 depends on
type of package and PC board layout as shown
in Table 1. The SPX2810 features the internal
thermal limiting to protect the device during
overload conditions. Special care needs to be
taken during continuous load conditions such
that the maximum junction temperature does
not exceed 125
°C. Thermal protection is acti-
vated at >144
°C and deactiviated at <137°C.
Taking the FR-4 printed circuit board and 1/16
thick with 1 ounce copper foil as an experiment,
the PCB material is effective at transmitting
heat with the tab attached to the pad area and a
ground plane layer on the backside of the sub-
strate. Refer to table 1 for the results of the
experiment.
The thermal interaction from other components
in the application can effect the thermal resis-
tance of the SPX2810. The actual thermal resis-
tance can be determined with experimentation.
SPX2810 power dissipation is calculated as
follows:
P
D = (VIN - VOUT)(IOUT)
Maximum Junction Temperature range:
T
J = TAMBIENT (max) + PD* (Junction to ambient
Thermal Resistance)
Although the SPX2810 offers some limiting
circuitry for overload conditions, it is still nec-
essary to insure that maximum junction
tepmerature is not exceeded. Heat will flow
through the lowest resistance path, in this case
the junction to case. Therfore proper mounting
of the regulator to the board is critical. The case
of the device is electrically connected to the
output. If the case must be electrically isolated,
a thermal nonconductive spacer should be used
between the case and the board. It thermal resis-
tance must be taken into account.
For example:
V
IN =10V, VOUT =5V. IOUT =1.5A and TA =50°C/W
Theta
JC = 3°C/W,
theta
SinkCase= 6°C/W thetaSink= 0.5°C/W
Power dissipation is calculated as
P
D= (VIN-VOUT)* IOUT=7.5W
Junction Temperature will be
T
J=TA + PD*(thetaCase-Hs +thetaHs + thetaJc) or
T
J = 50 + 7.5(0.5+6+3) = 121.25°C
Figure 7. Substrate Layout for SOT-223 for thermal
experiment.
50 X 50mm
35 X 17mm
16 X 10mm
APPLICATION INFORMATION
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