参数资料
| 型号： | SR1K20M155X |
| 厂商： | EPCOS Inc |
| 文件页数： | 20/29页 |
| 文件大小： | 0K |
| 描述： | VARISTOR 20VRMS W/RFI SUPP RAD |
| 标准包装： | 1,000 |
| 变阻器电压： | 33V |
| 电流 - 浪涌： | 800A |
| 电路数： | 1 |
| 最大交流电压： | 20VAC |
| 最大直流电压： | 26VDC |
| 能量： | 3.0J |
| 封装/外壳： | 径向，盒 - 2 引线，5.00mm 间距 |
| 其它名称： | 495-4367 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页当前第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 ° C and 180 ° C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Solderability tests
Test
Standard
Test conditions
Test conditions
Criteria/ test results
Sn-Pb soldering
Pb-free soldering
Wettability
IEC
Immersion in
Immersion in
Covering of 95% of
60068-2-58 60/40 SnPb solder
using non-activated
flux at 215 ± 3 ° C
for 3 ± 0.3 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ± 5 ° C
for 3 ± 0.3 s
end termination,
checked by visual
inspection
Leaching
IEC
Immersion in
Immersion in
No leaching of
resistance
Thermal shock
(solder shock)
60068-2-58 60/40 SnPb
solder using
mildly activated flux
without preheating
at 260 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
contacts
No deterioration of
electrical parameters.
Capacitance change:
≤ ± 15%
Tests of resistance IEC
Immersion in
Immersion in
Change of varistor
to soldering heat
60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5
voltage:
for SMDs
Tests of resistance IEC
at 260 ° C
Immersion
for 10 s at 260 ° C
Immersion
≤ ± 5%
Change of varistor
to soldering heat
for radial leaded
components
(SHCV)
60068-2-20
of leads in
60/40 SnPb
for 10 s at 260 ° C
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 ° C
voltage: ≤ ± 5%
Change of
capacitance X7R:
≤
5/+10%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 20 of 29
相关PDF资料 |
PDF描述 |
|---|---|
| SRP120LF | POLYSWITCH PTC RESET 1.2A STRAP |
| SRP120SF | POLYSWITCH PTC RESET 1.2A STRAP |
| SRP175F | POLYSWITCH STRAP 1.75A HOLD |
| SRP200F | POLYSWITCH STRAP 2.00A HOLD |
| SRP350F | POLYSWITCH STRAP 3.50A HOLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SR1K20M155Z | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Combination of a multilayer ceramic capacitor and a multilayer varistor, leaded |
| SR1K20M225X | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Ceramic transient voltage suppressors |
| SR1K20M225Z | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Combination of a multilayer ceramic capacitor and a multilayer varistor, leaded |
| SR1K20M474X | 功能描述:VARISTOR 20VRMS W/RFI SUPP RAD RoHS:是 类别:过电压，电流，温度装置 >> TVS - 变阻器，MOV 系列:SHCV 标准包装:300 系列:RA 变阻器电压:68V 电流 - 浪涌:1kA 电路数:1 最大交流电压:40VAC 最大直流电压:56VDC 能量:13J 封装/外壳:径向，盒式 |
| SR1LARU | 功能描述:Supervisor Open Drain or Open Collector 1 Channel 6-UDFN (1.45x1) 制造商:stmicroelectronics 系列:Smart Reset?? 包装:剪切带（CT） 零件状态:有效 类型:重置计时器 受监控电压数:1 输出:开路漏极或开路集电极 复位:低有效 复位超时:可调节/可选择 电压 - 阈值:可调节/可选择 工作温度:-40°C ~ 85°C（TA） 安装类型:表面贴装 封装/外壳:6-UDFN 供应商器件封装:6-UDFN（1.45x1） 标准包装:1 |
发布紧急采购，3分钟左右您将得到回复。