参数资料
型号: SRF55V02PMCC8
厂商: INFINEON TECHNOLOGIES AG
英文描述: Security & Chip Card ICs (my-d vicinity)
中文描述: 安全
文件页数: 4/9页
文件大小: 158K
代理商: SRF55V02PMCC8
my-d vicinity
SRF 55V02P
Short Product Information
4 / 9
2002-07-30
Document References
Confidential Data Sheet
Qualification report chip
Chip delivery specification for wafer with chip-layout (die size, orientation, …)
Module specification containing description of package, product logistic etc.
Qualification report module
Inlay specification containing description of package, product logistic etc.
Qualification report inlay
Development Tool Overview
my-d vicinity evaluation and demonstration kit
1
Ordering and Packaging information
Table 1
Ordering Information
Type
Package
1)
Memory
Pages
Ordering Code
User
Admin.
SRF 55V02P C
Die
Q67100H4896
SRF 55V02P MCC8 P-MCC8-2-1
on request
SRF 55V02P Y1.0
Inlay 45 x 45 mm
2
Q67100H4909
SRF 55V02P Y2.0
Inlay 45 x 76 mm
2
256 bytes
64 bytes
32
Q67100H4908
1)
Available as a die (C) for customer packaging, as inlay (Y) or as a Module Contactless Card (MCC) for embedding in
plastic cards
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