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参数资料
| 型号： | SRF55V02SMCC8 |
| 厂商： | INFINEON TECHNOLOGIES AG |
| 英文描述： | Security & Chip Card ICs (my-d vicinity) |
| 中文描述： | 安全 |
| 文件页数： | 4/10页 |
| 文件大小： | 163K |
| 代理商： | SRF55V02SMCC8 |
my-d vicinity
SRF 55V02S
Short Product Information
4 / 10
2002-07-30
Document References
―
Confidential Data Sheet
―
Qualification report chip
―
Chip delivery specification for wafer with chip-layout (die size, orientation, …)
―
Module specification containing description of package, product logistic etc.
―
Qualification report module
―
Inlay specification containing description of package, product logistic etc.
―
Qualification report inlay
Development Tool Overview
―
my-d vicinity evaluation and demonstration kit
1
Ordering and Packaging information
Table 1
Ordering Information
Type
Package
1)
Memory
Pages
Ordering Code
User
Admin.
SRF 55V02S C
Die
Q67100H4895
SRF 55V02S MCC8 P-MCC8-2-1
on request
SRF 55V02S Y1.0
Inlay 45 x 45 mm
2
Q67100H4910
SRF 55V02S Y2.0
Inlay 45 x 76 mm
2
256 bytes
64 bytes
32
Q67100H4911
1)
Available as a die (C) for customer packaging, as inlay (Y) or as a Module Contactless Card (MCC) for embedding in
plastic cards
相关PDF资料 |
PDF描述 |
|---|---|
| SRF55V10PY2.0 | Security & Chip Card ICs (my-d vicinity) |
| SRF55V10PY1.0 | SWITCH |
| SRF55V10PC | Security & Chip Card ICs (my-d vicinity) |
| SRF55V10PMCC8 | Security & Chip Card ICs (my-d vicinity) |
| SRF55V10P | Security & Chip Card ICs (my-d vicinity) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SRF55V02SNBF1SA3 | 制造商:Infineon Technologies AG 功能描述:IC EEPROM 2KBIT INTELLIG WAFER |
| SRF55V02SNBX1SA3 | 制造商:Infineon Technologies AG 功能描述:CONTACTLESS MEMORIES - Gel-pak, waffle pack, wafer, diced wafer on film |
| SRF55V02SY1.0 | 制造商:INFINEON 制造商全称:Infineon Technologies AG 功能描述:Security & Chip Card ICs (my-d vicinity) |
| SRF55V02SY2.0 | 制造商:INFINEON 制造商全称:Infineon Technologies AG 功能描述:Security & Chip Card ICs (my-d vicinity) |
| SRF55V10P | 制造商:INFINEON 制造商全称:Infineon Technologies AG 功能描述:Security & Chip Card ICs (my-d vicinity) |
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