参数资料
型号: SRF55V10SY2.0
厂商: INFINEON TECHNOLOGIES AG
英文描述: Security & Chip Card ICs (my-d vicinity)
中文描述: 安全
文件页数: 4/10页
文件大小: 163K
代理商: SRF55V10SY2.0
my-d vicinity
SRF 55V10S
Short Product Information
4 / 10
2002-07-30
Document References
Confidential Data Sheet
Qualification report chip
Chip delivery specification for wafer with chip-layout (die size, orientation, …)
Module specification containing description of package, product logistic etc.
Qualification report module
Inlay specification containing description of package, product logistic etc.
Qualification report inlay
Development Tool Overview
my-d vicinity evaluation and demonstration kit
1
Ordering and Packaging information
Table 1
Ordering Information
Type
Package
1)
Memory
Pages
Ordering Code
User
Admin.
SRF 55V10S C
Die
Q67100H4897
SRF 55V10S MCC8 P-MCC8-2-1
on request
SRF 55V10S Y1.0
Inlay 45 x 45 mm
2
Q67100H4906
SRF 55V10S Y2.0
Inlay 45 x 76 mm
2
1024 bytes
256 bytes
128
Q67100H4907
1)
Available as a die (C) for customer packaging, as inlay (Y) or as a Module Contactless Card (MCC) for embedding in
plastic cards
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