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| 型号： | SSM2304Z-EVAL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 6/20页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD FOR SSM2304Z |
| 标准包装： | 1 |
| 放大器类型： | D 类 |
| 输出类型： | 2 通道（立体声） |
| 在某负载时最大输出功率 x 通道数量： | 2.4W x 2 @ 4 欧姆 |
| 电源电压： | 2.5 V ~ 5 V |
| 工作温度： | -40°C ~ 85°C |
| 板类型： | 完全填充 |
| 已用 IC / 零件： | SSM2304 |
| 已供物品： | 板 |
| 相关产品： | SSM2304CPZ-REEL-ND - IC AMP AUDIO 2.4W STER D 16LFCSP SSM2304CPZ-REEL7DKR-ND - IC AMP AUDIO 2.4W STER D 16LFCSP SSM2304CPZ-REEL7CT-ND - IC AMP AUDIO 2.4W STER D 16LFCSP SSM2304CPZ-REEL7TR-ND - IC AMP AUDIO 2.4W STER D 16LFCSP |
| 其它名称： | Q3279966 |
SSM2304
Rev. 0 | Page 14 of 20
LAYOUT
As output power continues to increase, care needs to be taken to
lay out PCB traces and wires properly between the amplifier,
load, and power supply. A good practice is to use short, wide
PCB tracks to decrease voltage drops and minimize inductance.
Make track widths at least 200 mil for every inch of track length
for lowest DCR, and use 1 oz or 2 oz of copper PCB traces to
further reduce IR drops and inductance. A poor layout
increases voltage drops, consequently affecting efficiency. Use
large traces for the power supply inputs and amplifier outputs to
minimize losses due to parasitic trace resistance. Proper
grounding guidelines helps to improve audio performance,
minimize crosstalk between channels, and prevent switching
noise from coupling into the audio signal. To maintain high
output swing and high peak output power, the PCB traces that
connect the output pins to the load and supply pins should be as
wide as possible to maintain the minimum trace resistances. It
is also recommended to use a large-area ground plane for
minimum impedances. Good PCB layouts also isolate critical
analog paths from sources of high interference. High frequency
circuits (analog and digital) should be separated from low
frequency ones. Properly designed multilayer printed circuit
boards can reduce EMI emission and increase immunity to RF
field by a factor of 10 or more compared with double-sided
boards. A multilayer board allows a complete layer to be used
for ground plane, whereas the ground plane side of a double-
side board is often disrupted with signal crossover. If the system
has separate analog and digital ground and power planes, the
analog ground plane should be underneath the analog power
plane, and, similarly, the digital ground plane should be
underneath the digital power plane. There should be no overlap
between analog and digital ground planes nor analog and
digital power planes.
INPUT CAPACITOR SELECTION
The SSM2304 will not require input coupling capacitors if the
input signal is biased from 1.0 V to VDD 1.0 V. Input
capacitors are required if the input signal is not biased within
this recommended input dc common-mode voltage range, if
high-pass filtering is needed (Figure 37), or if using a single-
ended source (Figure 38). If high-pass filtering is needed at the
input, the input capacitor along with the input resistor of the
SSM2304 will form a high-pass filter whose corner frequency is
determined by the following equation:
fC = 1/(2π × RIN × CIN)
Input capacitor can have very important effects on the circuit
performance. Not using input capacitors degrades the output
offset of the amplifier as well as the PSRR performance.
PROPER POWER SUPPLY DECOUPLING
To ensure high efficiency, low total harmonic distortion (THD),
and high PSRR, proper power supply decoupling is necessary.
Noise transients on the power supply lines are short-duration
voltage spikes. Although the actual switching frequency can
range from 10 kHz to 100 kHz, these spikes can contain
frequency components that extend into the hundreds of
megahertz. The power supply input needs to be decoupled with
a good quality low ESL and low ESR capacitor—usually around
4.7 μF. This capacitor bypasses low frequency noises to the
ground plane. For high frequency transients noises, use a 0.1 μF
capacitor as close as possible to the VDD pin of the device.
Placing the decoupling capacitor as close as possible to the
SSM2304 helps maintain efficiency performance.
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| SSM2305CPZ-REEL | 功能描述:IC AMP AUDIO 2.8W MONO D 8LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 标准包装:2,000 系列:- 类型:AB 类 输出类型:2 通道（立体声） 在某负载时最大输出功率 x 通道数量:- 电源电压:4 V ~ 18 V 特点:- 安装类型:通孔 供应商设备封装:8-DIP 封装/外壳:8-DIP（0.300"，7.62mm） 包装:管件 |
| SSM2305CPZ-REEL7 | 功能描述:IC AMP AUDIO 2.8W MONO D 8LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:D 类 输出类型:1-通道（单声道），带立体声耳机 在某负载时最大输出功率 x 通道数量:930mW x 1 @ 8 欧姆; 40mW x 2 @ 16 欧姆 电源电压:2.7 V ~ 5.5 V 特点:消除爆音，差分输入，I²C，静音，关闭，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) 其它名称:MAX97000EWA+T-ND |
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