参数资料
型号: SSM2932ACBZ-RL
厂商: Analog Devices Inc
文件页数: 5/16页
文件大小: 0K
描述: IC HEADPHONE AMP STEREO 16WLCSP
标准包装: 10,000
类型: G 类
输出类型: 耳机,2-通道(立体声)
在某负载时最大输出功率 x 通道数量: 85mW x 1 @ 16 欧姆,45mW x 2 @ 32 欧姆
电源电压: 2.5 V ~ 3.6 V
特点: 消除爆音,差分输入,短路保护,关机
安装类型: 表面贴装
供应商设备封装: 16-WLCSP(1.64x1.64)
封装/外壳: 16-UFBGA,WLCSP
包装: 带卷 (TR)
Data Sheet
SSM2932
Rev. 0 | Page 13 of 16
In addition, good PCB layout isolates critical analog paths from
sources of high interference. High frequency circuits (analog
and digital) should be separated from low frequency circuits.
Properly designed multilayer PCBs can reduce EMI emissions
and increase immunity to the RF field by a factor of 10 or more
compared with double-sided boards. A multilayer board allows
a complete layer to be used for the ground plane, whereas the
ground plane side of a double-sided board is often disrupted by
signal crossover.
If the system has separate analog and digital ground and power
planes, the analog ground plane should be directly beneath the
analog power plane, and, similarly, the digital ground plane should
be directly beneath the digital power plane. There should be no
overlap between analog and digital ground planes or between
analog and digital power planes.
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