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参数资料
| 型号： | SSM3302ACPZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 17/20页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO 20W STER D 40LFCSP |
| 标准包装： | 2,500 |
| 类型： | D 类 |
| 输出类型： | 2 通道（立体声） |
| 在某负载时最大输出功率 x 通道数量： | 36.6W x 1 @ 2 欧姆; 24W x 2 @ 4 欧姆 |
| 电源电压： | 7 V ~ 18 V |
| 特点： | 消除爆音，差分输入，短路和热保护，关闭 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 40-LFCSP-WQ（6x6） |
| 封装/外壳： | 40-WFQFN 裸露焊盘，CSP |
| 包装： | 带卷 (TR) |
SSM3302
Data Sheet
Rev. A | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 2.
Parameter
Rating
Power Supply Voltage (PVDD)
0.3 V to +25 V
Analog Supply Voltage (AVDD)
0.3 V to +6 V
Input Voltage
0.3 V to +6 V
ESD Susceptibility
4 kV
Storage Temperature Range
65°C to +150°C
Operating Temperature Range
40°C to +85°C
Junction Temperature Range
65°C to +165°C
Lead Temperature (Soldering, 60 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA (junction to air) is specified for the worst-case conditions,
that is, a device soldered in a circuit board for surface-mount
packages. θJA and θJC are determined according to JESD51-9 on
a 4-layer printed circuit board (PCB) with natural convection
cooling.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
40-Lead, 6 mm × 6 mm LFCSP
31
2.5
°C/W
ESD CAUTION
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