68
Preliminary Specifications
FlashFlex51 MCU
SST89E52RD2 / SST89E54RD2 / SST89E58RD2 / SST89E516RD2
SST89V52RD2 / SST89V54RD2 / SST89V58RD2 / SST89V516RD2
2004 Silicon Storage Technology, Inc.
S71255-00-000
3/04
14.0 ELECTRICAL SPECIFICATION
Note:
This specification contains preliminary information on new products in production.
The specifications are subject to change without notice.
Absolute Maximum Stress Ratings
(Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Voltage on EA# Pin to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V
D.C. Voltage on Any Pin to Ground Potential. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to V
DD
+0.5V
Transient Voltage (<20ns) on Any Other Pin to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-1.0V to V
DD
+1.0V
Maximum I
OL
per I/O Pins P1.5, P1.6, P1.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA
Maximum I
OL
per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15mA
Package Power Dissipation Capability (T
a
= 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
(Based on package heat transfer limitations, not device power consumption.
TABLE
14-1: O
PERATING
R
ANGE
Symbol
T
a
Description
Ambient Temperature Under Bias
Standard
Industrial
Supply Voltage
SST89E5xxRD2
SST89V5xxRD2
Oscillator Frequency
SST89E5xxRD2
SST89V5xxRD2
Oscillator Frequency for IAP
SST89E5xxRD2
SST89V5xxRD2
Min.
Max
Unit
0
+70
+85
°
C
°
C
-40
V
DD
4.5
2.7
5.5
3.6
V
V
f
OSC
0
0
40
33
MHz
MHz
.25
.25
40
33
MHz
MHz
T14-1.0 1255
TABLE
14-2: R
ELIABILITY
C
HARACTERISTICS
Symbol
N
END1
T
DR1
I
LTH1
Parameter
Endurance
Data Retention
Latch Up
Minimum Specification
10,000
100
100 + I
DD
Units
Cycles
Years
mA
Test Method
JEDEC Standard A117
JEDEC Standard A103
JEDEC Standard 78
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
T14-2.0 1255