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参数资料
型号： STM32F103RCH7XXX
厂商： STMICROELECTRONICS
元件分类： 微控制器/微处理器
英文描述： 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PBGA64
封装： ROHS COMPLIANT, LFBGA-64
文件页数： 52/115页
文件大小： 1225K
代理商： STM32F103RCH7XXX
STM32F103xC, STM32F103xD, STM32F103xE
Electrical characteristics
41/115
5.3
Operating conditions
5.3.1
General operating conditions
Table 9.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
150
°C
Table 10.
General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
0
72
MHz
fPCLK1
Internal APB1 clock frequency
0
36
fPCLK2
Internal APB2 clock frequency
0
72
VDD
Standard operating voltage
2
3.6
V
VDDA
(1)
1.
When the ADC is used, refer to Table 58: ADC characteristics.
Analog operating voltage
(ADC not used)
Must be the same potential
as VDD
(2)
2.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
23.6
V
Analog operating voltage
(ADC used)
2.4
3.6
VBAT
Backup operating voltage
1.8
3.6
V
P
D
Power dissipation at TA =
85 °C for suffix 6 or TA =
105 °C for suffix 7(3)
3.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal
characteristics on page 108).
LQFP144
666
mW
LQFP100
434
LQFP64
444
LFBGA100
500
LFBGA144
500
TA
Ambient temperature for 6
suffix version
Maximum power dissipation
–40
85
°C
Low power dissipation(4)
4.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 6.2: Thermal characteristics on page 108).
–40
105
Ambient temperature for 7
suffix version
Maximum power dissipation
–40
105
°C
Low power dissipation(4)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
°C
7 suffix version
–40
125
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